Image sensor and image capturing apparatus

ABSTRACT

A pixel array includes a plurality of pixel blocks each formed of a plurality of pixels. A signal processing unit and a corresponding one of the pixel blocks are connected by a plurality of first signal lines. The signal processing unit and a corresponding one of transfer units are connected by a plurality of second signal lines. The signal processing unit includes a conversion circuit that sequentially performs analog-to-digital conversion on first signals input from the plurality of first signal lines during an identical period. The transfer units are disposed in a direction different from a first direction in which the first signal lines are provided, with respect to the circuit array in a second substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of International Patent Application No. PCT/JP2018/034574, filed Sep. 19, 2018, which claims the benefit of Japanese Patent Application No. 2017-191756, filed Sep. 29, 2017 and Japanese Patent Application No. 2017-206379, filed Oct. 25, 2017, both of which are hereby incorporated by reference herein in their entirety.

TECHNICAL FIELD

The present invention relates to an image sensor and an image capturing apparatus.

BACKGROUND ART

In recent years, image capturing apparatuses including an image sensor, such as a CMOS sensor, have become more multifunctional. For example, PTL 1 discloses an image capturing apparatus configured to be capable of performing pupil division focus detection by using signals obtained from an image sensor, as well as generating a captured image such as a still image or moving image. In the configuration described in PTL 1, an increase in the amount of data causes a longer readout time, resulting in a lower frame rate and increased power consumption. PTL 2 discloses control for switching between an operation state and a standby state in accordance with a result of computation by a computing unit for each pixel block to save power of an analog-to-digital conversion circuit (hereinafter referred to as an ADC circuit) in an image sensor.

CITATION LIST Patent Literature

PTL 1: Japanese Patent Laid-Open No. 2001-124984

PTL 2: Japanese Patent Laid-Open No. 2016-184843

However, individual pixels in PTL 2 are based on the assumption of having a conventional configuration of obtaining a captured image, and it is not clear how pixel blocks are configured. Furthermore, it is not clear how the pixel blocks are configured and controlled in the case of a pixel configuration capable of performing focus detection in addition to generating a captured image as in PTL 1, and there is a possibility that power consumption may increase.

An object of the present invention is to provide an image sensor and an image capturing apparatus that are capable of realizing power saving of the image sensor while suppressing a decrease in frame rate caused by an increase in the amount of data.

SUMMARY OF INVENTION

An image sensor according to the present invention is an image sensor including a first substrate and a second substrate that are stacked one on top of another, the first substrate having a pixel array in which a plurality of pixels for performing photoelectric conversion are disposed in matrix, the second substrate having a circuit array in which a plurality of signal processing units that process first signals based on the photoelectric conversion are disposed in matrix and having transfer units that transfer second signals processed by the signal processing units to an outside. The pixel array includes a plurality of pixel blocks each formed of a plurality of pixels. Each of the signal processing units and a corresponding one of the pixel blocks are connected by a plurality of first signal lines. Each of the signal processing units and a corresponding one of the transfer units are connected by a plurality of second signal lines. Each of the signal processing units includes a conversion circuit that sequentially performs analog-to-digital conversion on the first signals input from the plurality of first signal lines during an identical period. The transfer units are disposed in a direction different from a first direction in which the first signal lines are provided, with respect to the circuit array in the second substrate.

Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a block diagram illustrating a schematic configuration of an image capturing apparatus according to a first embodiment of the present invention.

FIG. 2 is a block diagram illustrating a schematic configuration of an image sensor according to the first embodiment of the present invention.

FIG. 3 is a plan view illustrating an example of pixel arrangement of the image sensor in the image capturing apparatus according to the first embodiment of the present invention.

FIG. 4 is a schematic diagram illustrating a relationship between fluxes of light from an exit pupil of an image capturing optical system and a unit pixel.

FIG. 5A is a graph illustrating an example of image signal waveforms obtained from two sub-pixels of the image sensor.

FIG. 5B is a graph illustrating an example of image signal waveforms obtained from two sub-pixels of the image sensor.

FIG. 6 is a schematic diagram illustrating an example of the configuration of the image sensor in the image capturing apparatus according to the first embodiment of the present invention.

FIG. 7 is a diagram illustrating an example of the circuit configuration of a unit pixel of the image sensor in the image capturing apparatus according to the first embodiment of the present invention.

FIG. 8 is a diagram illustrating an example of the configuration of a common-to-column readout circuit of the image sensor in the image capturing apparatus according to the first embodiment of the present invention.

FIG. 9 is a timing chart illustrating a readout operation of the image sensor in the image capturing apparatus according to the first embodiment of the present invention.

FIG. 10 is a timing chart illustrating a readout operation of the image sensor in the image capturing apparatus according to the first embodiment of the present invention.

FIG. 11 is a diagram illustrating an example of the configuration of a common-to-column readout circuit of an image sensor in an image capturing apparatus according to a second embodiment of the present invention.

FIG. 12 is a timing chart illustrating a readout operation of the image sensor in the image capturing apparatus according to the second embodiment of the present invention.

FIG. 13 illustrates an example of a pixel block according to the second embodiment of the present invention.

FIG. 14 is a diagram illustrating an example of the configuration of a common-to-column readout circuit of an image sensor in an image capturing apparatus according to a third embodiment of the present invention.

FIG. 15 is a timing chart illustrating a readout operation of the image sensor in the image capturing apparatus according to the third embodiment of the present invention.

FIG. 16 is a timing chart illustrating a readout operation of an image sensor in an image capturing apparatus according to a fourth embodiment of the present invention.

FIG. 17 is a timing chart illustrating a readout operation of the image sensor in the image capturing apparatus according to the fourth embodiment of the present invention.

FIG. 18A is a timing chart illustrating a readout operation of the image sensor in the image capturing apparatus according to the fourth embodiment of the present invention.

FIG. 18B is a timing chart illustrating a readout operation of the image sensor in the image capturing apparatus according to the fourth embodiment of the present invention.

FIG. 19A is a schematic diagram illustrating an example of the configuration of an image sensor in an image capturing apparatus according to a fifth embodiment of the present invention.

FIG. 19B is a schematic diagram illustrating an example of the configuration of the image sensor in the image capturing apparatus according to the fifth embodiment of the present invention.

FIG. 20 is a schematic diagram illustrating an example of wiring lines of the image sensor in the image capturing apparatus according to the fifth embodiment of the present invention.

FIG. 21 is a diagram illustrating an example of the configuration of a common-to-column readout circuit of the image sensor in the image capturing apparatus according to the fifth embodiment of the present invention.

FIG. 22 is a timing chart illustrating a readout operation of an image sensor in an image capturing apparatus according to a sixth embodiment of the present invention.

FIG. 23 illustrates an example of a pixel block according to a seventh embodiment of the present invention.

FIG. 24A is a schematic diagram illustrating an example of the configuration of an image sensor in an image capturing apparatus according to the seventh embodiment of the present invention.

FIG. 24B is a schematic diagram illustrating an example of the configuration of the image sensor in the image capturing apparatus according to the seventh embodiment of the present invention.

FIG. 25 is a configuration diagram of correction parameters according to the seventh embodiment of the present invention.

FIG. 26 is an internal configuration diagram of an ADC circuit according to an eighth embodiment of the present invention.

FIG. 27 is a timing chart illustrating an operation of the ADC circuit according to the eighth embodiment of the present invention.

FIG. 28 is an explanatory diagram of an internal configuration of an image sensor according to a ninth embodiment of the present invention.

FIG. 29 is a diagram illustrating an example of the configuration of a common-to-column readout circuit of the image sensor in the image capturing apparatus according to the ninth embodiment of the present invention.

FIG. 30 is a diagram illustrating the configuration of circuit blocks in a stage subsequent to signal processing units 21 according to the ninth embodiment of the present invention.

FIG. 31 is a timing chart illustrating a readout operation of the image sensor in the image capturing apparatus according to the ninth embodiment of the present invention.

FIG. 32 is a timing chart illustrating a readout operation of the image sensor in the image capturing apparatus according to the ninth embodiment of the present invention.

FIG. 33A is a timing chart illustrating a readout operation of the image sensor in the image capturing apparatus according to the ninth embodiment of the present invention.

FIG. 33B is a timing chart illustrating a readout operation of the image sensor in the image capturing apparatus according to the ninth embodiment of the present invention.

FIG. 34 is a diagram illustrating the configuration of circuit blocks in a stage subsequent to signal processing units 21 according to modification example 1 of the ninth embodiment of the present invention.

FIG. 35 is a timing chart illustrating a readout operation of an image sensor in an image capturing apparatus according to modification example 1 of the ninth embodiment of the present invention.

FIG. 36 is a diagram illustrating the configuration of circuit blocks in a stage subsequent to signal processing units 21 according to modification example 2 of the ninth embodiment of the present invention.

DESCRIPTION OF EMBODIMENTS First Embodiment

An image sensor and an image capturing apparatus according to a first embodiment of the present invention will be described with reference to individual figures. At that time, those having the same function will be denoted by the same numerals in all the figures, and repeated description thereof will be omitted.

First, a schematic configuration of an image capturing apparatus 100 according to this embodiment will be described with reference to FIG. 1.

As illustrated in FIG. 1, the image capturing apparatus 100 according to this embodiment includes a first lens group 101, a diaphragm 102, a second lens group 103, a third lens group 104, an optical low-pass filter 105, and an image sensor 106. The image capturing apparatus 100 also includes a diaphragm actuator 117, a focus actuator 118, a diaphragm driving circuit 115, and a focus driving circuit 116. The image sensor 106 includes a signal processing unit 107. The image capturing apparatus 100 further includes a digital front end (DFE) 108 and a digital signal processor (DSP) 109. The image capturing apparatus 100 also includes a display unit 111, a RAM 112, a timing generation circuit (TG) 113, a CPU 114, a ROM 119, and a recording medium 110.

The first lens group 101, the diaphragm 102, the second lens group 103, the third lens group 104, and the optical low-pass filter 105 are disposed in this order from a subject side along an optical axis, and these components constitute an image capturing optical system. The image capturing optical system corresponds to an optical system for forming an optical image of a subject. The first lens group 101 is a lens group disposed at the foremost portion (subject side) of the image capturing optical system and is held so as to be movable back and forth in an optical-axis direction. The diaphragm 102 has a function of adjusting the amount of light during image capturing when the opening diameter thereof is adjusted. The second lens group 103 moves back or forth in the optical-axis direction in conjunction with the diaphragm 102, and performs a magnification change operation (zoom function) in conjunction with a back or forth movement of the first lens group 101. The third lens group 104 has a function of adjusting focus by moving back or forth in the optical-axis direction. The optical low-pass filter 105 is an optical element for reducing color noise or moire of a captured image.

In this embodiment, an example is given in which a lens apparatus including the image capturing optical system is integrated with the main body of the image capturing apparatus 100, but an embodiment of the present invention is not limited thereto. The present invention is also applicable to an image capturing system constituted by a main body of an image capturing apparatus and a lens apparatus (image capturing optical system) that is removably attached to the main body of the image capturing apparatus.

The diaphragm actuator 117 includes a mechanism for changing the opening diameter of the diaphragm 102. The diaphragm driving circuit 115 is a driving circuit for controlling the opening diameter of the diaphragm 102 by using the diaphragm actuator 117 to adjust the amount of light for image capturing and for controlling an exposure time during still image capturing. The focus actuator 118 includes a mechanism for driving the third lens group 104 back and forth in the optical-axis direction. The focus driving circuit 116 is a driving circuit for driving the focus actuator 118 to adjust a focus position.

The image sensor 106 is a two-dimensional CMOS image sensor disposed on an image formation surface of the image capturing optical system. The image sensor 106 according to this embodiment is, unlike an ordinary image sensor, a multilayer image sensor having a multilayer structure as illustrated in FIG. 2. More specifically, the image sensor 106 has a multilayer structure in which a first substrate 10 and a second substrate 20 are stacked one on top of another. The first substrate 10 includes pixel portions 11 that perform photoelectric conversion on incident light. The second substrate 20 includes signal processing units 21 that process signals from the pixel portions 11, and peripheral circuits or the like. The pixel portions 11 and the signal processing units 21 are periodically arranged in a row direction and a column direction within the respective substrates. Although two substrates are stacked in this embodiment, more substrates may be stacked. For example, stacking of a substrate including a memory such as a DRAM or a substrate including a different signal processing circuit enables the image sensor 106 to have a new function. The peripheral circuits included in the second substrate 20 in this embodiment include a power supply circuit, a timing generation circuit, a register, an output amplifier, and the like.

The image sensor 106 converts a subject image (optical image) formed by the image capturing optical system into an electric signal by photoelectric conversion. In this specification, the image sensor 106 may be referred to as an image capturing unit. The TG 113 supplies, to the image sensor 106 or the like, a driving signal for driving the image sensor 106 or the like at a predetermined timing. A driving signal includes a clock signal and a synchronization signal for operating the image sensor 106, and further includes various setting parameters or the like for changing modes to select driving of the image sensor 106. The TG 113 may be provided as an internal TG inside the image sensor 106 and may be configured to generate a driving signal on the basis of a synchronization signal supplied from the outside. The modes to select driving of the image sensor 106 include at least a still image mode, a moving image mode, and a live view mode.

The signal processing unit 107 is provided in the image sensor 106 and includes at least an ADC circuit that converts an analog image signal output from a pixel portion into a digital image signal.

The DFE 108 has a function of performing predetermined computation processing on a digital image signal output from the image sensor 106. The DSP 109 has a function of performing correction processing, development processing, and the like on a digital image signal output from the DFE 108. The DSP 109 also has a function of performing auto-focus (AF) computation for calculating the amount of deviation from a focal point by using an image signal (digital image signal). The DFE 108 and the DSP 109 include a reconfigurable circuit, such as an FPGA circuit. By forming various circuit configurations in accordance with external settings, a complicated correction operation and the like can be performed by using small circuit resources.

The display unit 111 has a function of displaying a captured image, various menu screens, and so forth. A liquid crystal display (LCD), an organic EL display (OELD), or the like is used as the display unit 111. The RAM 112 is a random access memory for temporarily storing data of a captured image or the like. The ROM 119 is a read only memory for storing various corrected data, a program for executing predetermined processing, and the like. The recording medium 110 is for recording data of a captured image. The recording medium 110 may be a removable medium, for example, a memory card using a nonvolatile semiconductor memory such as an SD memory card. The RAM 112, the ROM 119, and the recording medium 110 are connected to the DSP 109.

The CPU 114 is a control device that controls the entire image capturing apparatus 100 and centrally controls individual components. In addition, the CPU 114 sets various setting parameters or the like to the individual components. The CPU 114 includes a cache memory or the like on which data can be electrically written and from which data can be electrically erased, and executes a program recorded thereon. The memory is used as a region for storing a program executed by the CPU, a work region while a program is being executed, a region for storing data, or the like. In addition, the CPU 114 analyzes a signal output from the image sensor 106 and performs image processing. A result of analysis is output as image information. The image information is an image analysis result and includes not only the brightness and color of a subject but also the presence/absence and characteristics of an object (including a human body), the position/speed/acceleration of the object, a detection result of a specific subject, and so forth. In addition, the CPU 114 controls the focus driving circuit 116 on the basis of an AF computation result output from the DSP 109, and adjusts a focus position of the image capturing optical system by using the focus actuator 118.

Next, an example of the pixel arrangement of the image sensor 106 in the image capturing apparatus 100 according to this embodiment will be described with reference to FIG. 3. The pixel arrangement illustrated in FIG. 3 corresponds to the arrangement of the pixel portions 11 included in the first substrate 10.

The image sensor 106 has a pixel area PA (pixel array) in which a plurality of pixel portions 11 (unit pixels) are two-dimensionally arranged in array in the row direction and the column direction, as illustrated in FIG. 3, for example. The pixel area PA may include, although not particularly limited, a pixel array of the pixel portions 11 in 4000 rows×8000 columns, for example. FIG. 3 illustrates a pixel array of 6 rows×8 columns among them.

Each pixel portion 11 includes two photodiodes (hereinafter referred to as “PDs”) 401 a and 401 b, one microlens (not illustrated), and a color filter (not illustrated). The PD 401 a and the PD 401 b are photoelectric conversion units of two sub-pixels a and b formed in the pixel portion 11, respectively. Each pixel portion 11 is provided with one microlens, which concentrates incident light onto the two photoelectric conversion units of the pixel portion 11.

Reference symbols a and b in each pixel portion 11 in FIG. 3 represent the sub-pixels a and b on the left and right as a result of pupil division. An output signal a (A signal) output from the sub-pixel a and an output signal b (B signal) output from the sub-pixel b are focus detection signals used for focus detection. A signal obtained by adding the A signal and the B signal (A+B signal) is used to generate an image (generate a captured image). Reference symbols R, G, and B represent the colors (spectral characteristics) of the color filters. R represents a red filter, G represents a green filter, and B represents a blue filter. The two PDs 401 a and 401 b constituting one pixel portion 11 have a color filter of the same color assigned thereto. FIG. 3 illustrates an example in which the color filters are disposed in a so-called Bayer array, but the disposition of the color filters is not limited thereto. In addition, a pupil division direction is not limited to the direction for dividing a pixel into left and right portions, and may be a direction for dividing a pixel into upper and lower portions or a direction for dividing a pixel into three or more portions.

Next, a relationship between fluxes of light from an exit pupil of the image capturing optical system (image capturing lens) and the pixel portion 11 of the image sensor 106 will be described with reference to FIG. 4. The pixel portion 11 includes the PDs 401 a and 401 b, and a color filter 201 and a microlens 202 disposed above the PDs 401 a and 401 b. Assume a case where fluxes of light passed through an exit pupil 203 of the image capturing optical system (image capturing lens) enter the pixel portion 11, with an optical axis 204 of the image capturing optical system being the center. Regarding the fluxes of light that pass through pupil regions (partial regions) 205 and 206 different from each other of the exit pupil 203 of the image capturing optical system (image capturing lens), the flux of light passed through the pupil region 205 is received by the PD 401 a of the sub-pixel a through the microlens 202. On the other hand, the flux of light passed through the pupil region 206 is received by the PD 401 b of the sub-pixel b through the microlens 202.

In this way, the sub-pixels a and b receive light rays passed through separate regions (regions different from each other) of the exit pupil 203 of the image capturing lens. Thus, as a result of comparing the A signal, which is an output signal of the sub-pixel a, and the B signal, which is an output signal of the sub-pixel b, focus detection using a phase difference can be performed.

Next, image signal waveforms obtained from the sub-pixels a and b of the image sensor 106 will be described with reference to FIG. 5A and FIG. 5B. FIG. 5A is a graph illustrating an example of image signal waveforms obtained from the sub-pixels a and b in an out-of-focus state (defocused state). FIG. 5B is a graph illustrating an example of image signal waveforms obtained from the sub-pixels a and b in an in-focus state (substantially in-focus state). In FIG. 5A and FIG. 5B, the vertical axis represents signal output, and the horizontal axis represents position (pixel horizontal position).

In an out-of-focus state (in a defocused state), the image signal waveforms obtained from the sub-pixels a and b (A signal and B signal) do not match each other and are largely deviated from each other as illustrated in FIG. 5A. When the state changes from the out-of-focus state to be closer to an in-focus state, the deviation between the image signal waveforms of the sub-pixels a and b becomes smaller as illustrated in FIG. 5B. In an in-focus state, these image signal waveforms overlap each other. In this way, as a result of detecting a deviation (the amount of deviation) between the image signal waveforms obtained from the sub-pixels a and b, the amount of out-of-focus (the amount of defocusing) can be detected, and focus adjustment of the image capturing optical system can be performed by using information about the detection.

Next, an example configuration of the image sensor 106 in the image capturing apparatus 100 according to this embodiment will be described in detail.

The image sensor 106 has a multilayer structure in which the first substrate 10 including the pixel portions 11 and the second substrate 20 including the signal processing units 21 are stacked one on top of another, as illustrated in FIG. 2. FIG. 6 is a diagram illustrating a positional relationship on a plane between the disposition of the pixel portions 11 and the signal processing units 21. Each white square represents one pixel portion 11 provided in the first substrate 10, and a character attached thereto represents the color of the color filter provided to the pixel portion 11. Each gray rectangle disposed at the back surfaces of the pixel portions 11 represents one signal processing unit 21 provided in the second substrate 20.

As illustrated in FIG. 6, a plurality of pixel portions 11 and a plurality of signal processing units 21 are periodically arranged in the row direction and the column direction within the respective substrates to form a pixel array and a circuit array. The area of the pixel portions 11 in the first substrate 10 is smaller than the area of the signal processing units 21 in the second substrate 20. Thus, a predetermined number of pixel portions 11 surrounded by a broken line are regarded as a pixel block 12, and the signal processing units 21 are disposed corresponding to the pixel blocks 12 on a one-to-one basis. In this embodiment, the pixel portions 11 in 4 rows×12 columns are regarded as one pixel block 12. This is one example, and a different number of pixels or a different array may be regarded as one pixel block 12. In addition, the signal processing unit 21 corresponding to each pixel block 12 need not necessarily correspond to the pixel block 12 in terms of the position (for example, need not necessarily be positioned immediately under the pixel portions 11). The pixel portions 11 and the signal processing units 21 may be apart from each other.

As illustrated in FIG. 7, each pixel portion 11 includes the PDs 401 a and 401 b, transfer transistors 402 a and 402 b, a reset transistor 405, an amplification transistor 404, and a selection transistor 406. The anode of the PD 401 a is connected to a ground voltage line, and the cathode of the PD 401 a is connected to the source of the transfer transistor 402 a. The anode of the PD 401 b is connected to the ground voltage line, and the cathode of the PD 401 b is connected to the source of the transfer transistor 402 b. The drain of the transfer transistor 402 a and the drain of the transfer transistor 402 b are connected to the source of the reset transistor 405 and the gate of the amplification transistor 404. A connection node of the drains of the transfer transistors 402 a and 402 b, the source of the reset transistor 405, and the gate of the amplification transistor 404 serves as a floating diffusion portion (hereinafter referred to as an “FD portion”) 403. The drain of the reset transistor 405 and the drain of the amplification transistor 404 are connected to a power supply voltage line (voltage Vdd). The source of the amplification transistor 404 is connected to the drain of the selection transistor 406.

The PDs 401 a and 401 b of the sub-pixels a and b each perform photoelectric conversion on an optical signal (optical image) input thereto and store a charge corresponding to the amount of exposure. The transfer transistors 402 a and 402 b transfer the charges stored in the PDs 401 a and 401 b to the FD portion 403 in accordance with signals PTXA and PTXB at a high level, respectively. The FD portion 403 converts the charges transferred from the PDs 401 a and 401 b into a voltage corresponding to the amount of charge by the parasitic capacitance thereof, and applies the voltage to the gate of the amplification transistor 404. The reset transistor 405 is a switch circuit for resetting the FD portion 403 and resets the FD portion 403 in accordance with a signal PRES at a high level. In the case of resetting the charges of the PDs 401 a and 401 b, the signal PRES and the signals PTXA and PTXB are simultaneously set to a high level to turn ON the transfer transistors 402 a and 402 b and the reset transistor 405. Subsequently, the PDs 401 a and 401 b are reset via the FD portion 403. The selection transistor 406 outputs a pixel signal converted into a voltage by the amplification transistor 404 to an output node vout of the pixel portion 11 (pixel) in accordance with a signal PSEL at a high level.

On the extension of each row of the pixel array of the first substrate 10, a driving signal line that is not illustrated is disposed in the row direction. The driving signal line is connected to a vertical scanning circuit provided in the first substrate 10 or the second substrate 20. A predetermined driving signal for driving a pixel readout circuit of the pixel portions 11 is output from the vertical scanning circuit to the driving signal line at a predetermined timing. Specifically, each driving signal line includes a plurality of (for example, four) signal lines for supplying the above-described signal PTXA, signal PTXB, signal PRES, and signal PSEL to the plurality of pixel portions 11 arranged in the row direction. These signal lines form a signal line common to the plurality of pixel portions 11 belonging to the same row.

A readout circuit for reading out a signal from each pixel portion 11 in the image sensor 106 will be described with reference to FIG. 8. FIG. 8 illustrates an equivalent circuit about the readout circuit of the image sensor 106. FIG. 8 illustrates only the pixel portions 11 disposed in the odd columns among the pixel portions illustrated in FIG. 6. Each column of the pixel portions 11 in the first substrate 10 has four signal lines 803 a. The signal lines 803 a are connected to signal lines 803 b having current sources 802 in the second substrate 20 via connection portions 801. Signals output from the respective pixel portions 11 are read out from the first substrate 10 to the second substrate 20 through the signal lines 803 a and the signal lines 803 b. Hereinafter, the signal lines 803 a and the signal lines 803 b will be simply referred to as signal lines 803 when they are not distinguished from each other. Each column of the pixel portions 11 has four signal lines 803, and each signal line is represented by col_xN (x: the column number of the pixel portions 11, N: A, B, C, or D). Specifically, the pixel portions 11 in the first row are connected to col_xA. Likewise, the pixel portions 11 in the second to fourth rows are connected to signal lines col_xB to col_xD, respectively. The signal lines 803 are arranged in the same manner as those for the pixel portions 11 in the first column also in the other columns. Although each column of the pixel portions 11 has four signal lines 803 in this embodiment, the configuration is not limited thereto. To perform readout at higher speed, it is preferable to provide more signal lines 803. Note that the number of signal lines is preferably a multiple of 2 or 4. Although FIG. 8 illustrates only one pixel block 12, a plurality of pixel blocks are disposed in matrix in the pixel array. That is, the signal lines 803 are shared with the pixel portions 11 of other pixel blocks.

The individual signal lines 803 are connected to the signal processing units 21 provided in the second substrate 20. In the image sensor 106 according to this embodiment, the signal processing units 21 are provided for the pixel blocks 12, each including a plurality of pixel portions 11, on a one-to-one basis, as illustrated in FIG. 6. Thus, a plurality of signal lines 803 are connected to each signal processing unit 21. The signal processing unit 21 includes a multiplexer circuit 804 (hereinafter referred to as an MPX circuit), and the plurality of signal lines 803 are connected to the input of the MPX circuit 804. Furthermore, the signal processing unit 21 includes an ADC circuit 805, and the ADC circuit 805 is connected to the output of the MPX circuit 804. With the MPX circuit 804 being provided between the plurality of signal lines 803 and the ADC circuit 805, the signal processing unit 21 is capable of processing a plurality of signals at high speed in time division by using the single ADC circuit 805. Although the details will be described in another embodiment described below, the ADC circuit 805 adopts a successive approximation AD conversion method in this embodiment. Use of this method enables higher speed operation and lower power consumption of the ADC circuit 805. In this embodiment, the MPX circuit 804 corresponds to a selecting unit for selecting a signal line to be connected to the ADC circuit 805 from among the plurality of signal lines 803.

In this embodiment, the signal processing unit 21 includes two MPX circuits 804 a and 804 b, and ADC circuits 805 a and 805 b correspond thereto, respectively. The MPX circuit 804 a is configured to be capable of receiving signals from col_xA and col_xC connected to the pixels having an R color filter. The MPX circuit 804 b is configured to be capable of receiving signals from col_xB and col_xD connected to the pixels having a G color filter. The output of the MPX circuit 804 a is connected to the ADC circuit 805 a, and the output of the MPX circuit 804 b is connected to the ADC circuit 805 b. Each ADC circuit 805 is capable of independently operating an ADC function. Although the signal processing unit 21 according to this embodiment has a configuration including two MPX circuits and two ADC circuits, the configuration is not limited thereto. The signal processing unit 21 may include only one MPX circuit and only one ADC circuit, or may include three or more MPX circuits and three or more ADC circuits.

In addition, although the signal lines 803 and the MPX circuits 804 are directly connected to each other, a sample hold circuit that is not illustrated may be provided therebetween, and signals read out from the pixel portions 11 may be temporarily held therein.

In addition, the ADC circuits 805 according to this embodiment are capable of performing a power saving operation (standby operation) collectively or individually. To control the power saving operation, a PSAVE control unit 806 is provided in the second substrate 20. In accordance with a control signal from the PSAVE control unit 806, each ADC circuit 805 starts or ends a power saving operation. An example of the power saving operation is an operation of stopping the supply of power or clock to the ADC circuit 805. The PSAVE control unit 806 may be provided in the signal processing unit 21 or may be provided in units of regions, for example, in units of rows or in units of columns.

Although FIG. 8 illustrates only the pixel portions 11 provided in the odd columns, the pixel portions 11 disposed in the even columns also have a similar circuit configuration.

FIG. 9 is a diagram illustrating a normal readout operation of the image sensor 106. In the operation in FIG. 9, signals are sequentially read out from the pixel portions 11 without the signals being added. This normal read operation is used mainly in the case of obtaining a high-definition still image. With reference to FIG. 9, a description will be given of the case of outputting only signals for image capturing without outputting signals for focus detection. That is, each pixel portion 11 does not output a first signal based on a signal of only one of the plurality of PDs, but outputs only a second signal based on signals of the plurality of PDs.

A signal PRES in FIG. 9 is a signal supplied from the vertical scanning circuit to the gates of the reset transistors 405 through a control line that is not illustrated. Likewise, a signal PSEL is a signal supplied from the vertical scanning circuit to the gates of the selection transistors 406 of the pixel portions 11 in the N-th row through a control line. The signal PSEL is illustrated together with the row position of the pixel portions 11 to which the signal is output indicated at the end thereof. That is, a signal PSEL(1) is a signal PSEL output to the pixel portions 11 in the first row. A signal PTXA is a signal supplied from the vertical scanning circuit to the gates of the transfer transistors 402 a through a control line. A signal PTXB is a signal supplied from the vertical scanning circuit to the gates of the transfer transistors 402 b through a control line. The signal PSEL has been described as a signal corresponding to each row. Alternatively, a plurality of signals PSEL may be supplied to each row. With this configuration, a pixel from which a signal is to be output can be selected periodically also in the column direction.

A signal PSAVE in FIG. 9 is a signal supplied from the PSAVE control unit 806 to each ADC circuit 805. In response to input of a signal at a high level to the ADC circuit 805, the ADC circuit 805 starts a power saving operation. In response to input of a signal at a low level to the ADC circuit 805, the ADC circuit 805 performs a normal operation. Although the signal PSAVE is described as a single signal to simplify the description in this embodiment, the signal PSAVE is not limited thereto. For example, in a configuration in which the signal PSAVE can be individually supplied in units of regions in the pixel array or in units of the ADC circuits 805, a power saving operation can be controlled in units of regions.

FIG. 9 illustrates an operation related to the MPX circuit 804 a and the ADC circuit 805 a. The MPX circuit 804 a and the ADC circuit 805 a receive signals of the pixel portions 11 located in the first and third rows provided with R color filters and in the odd columns among the first to twelfth columns in the arrangement of the pixel block 12, as illustrated in FIG. 8. Thus, FIG. 9 illustrates an operation related to the operation of the pixel portions 11 located in the first and third rows and in the odd columns among the first to twelfth columns.

In addition, FIG. 9 illustrates the names Col_xN of signal lines, indicating the columns selected by the MPX circuit 804 a as the columns outputting signals to the ADC circuit 805 a. The meaning of xN is as follows. “x” represents a column number of the pixel portions 11. “N” represents any one of the four signal lines 803 arranged corresponding to the pixel portions 11 in one column.

At time t1, the vertical scanning circuit causes the signals PRES to be output to the pixel portions 11 in the first and third rows to be kept at a high level. Accordingly, the reset transistors 405 of the pixel portions 11 in the first row are in an ON state. Thus, the FD portions 403 are reset to a potential corresponding to the power supply voltage Vdd. In addition, at time t1, the vertical scanning circuit causes the signal PSEL(1) to be at a high level. Accordingly, the selection transistors 406 of the pixel portions 11 in the first row are turned ON. Thus, the currents supplied from the current sources 802 illustrated in FIG. 8 are supplied to the amplification transistors 404 of the pixel portions 11 in the first row through the selection transistors 406. Accordingly, a source follower circuit made up of the power supply voltage Vdd, the amplification transistor 404, and the current source 802 is formed. That is, the amplification transistor 404 performs a source follower operation of outputting a signal corresponding to the potential of the FD portion 403 to the signal line 803 via the selection transistor 406. In this embodiment, a period from time t1 corresponds to an N signal readout period.

At time t2, the vertical scanning circuit causes the signal PRES to be output to the pixel portions 11 in the first row to be at a low level. Accordingly, the reset transistors 405 of the pixel portions 11 in the first row are turned OFF. Thus, resetting of the FD portions 403 is cancelled. Each amplification transistor 404 outputs a signal based on the potential of the FD portion 403 at which resetting has been cancelled to the corresponding signal line 803 illustrated in FIG. 8. This signal is referred to as an N signal (noise signal). Accordingly, N signals are output from the pixel portions 11 to the signal lines 803 in the respective columns. Accordingly, the N signals corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns are input to the MPX circuit 804 a during the same period.

At and after time t2, the MPX circuit 804 a sequentially connects the signal lines 803 corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns to the ADC circuit 805 a in accordance with signals MPX supplied from the TG 113.

The ADC circuit 805 a AD-converts the N signal of the signal line 803 in the first column corresponding to the pixel portion 11 in the first row, output from the MPX circuit 804 a, into a digital signal. After that, the ADC circuit 805 a sequentially AD-converts the N signals output to the signal lines 803 a corresponding to the pixel portions 11 in the first row in the odd columns among the first to twelfth columns into digital signals. Because each N signal has already been input to the MPX circuit 804 a, high-speed AD conversion can be performed only by switching an output of the MPX circuit 804 a. In this embodiment, a period from time t2 corresponds to an N signal AD conversion period.

At time t3, the vertical scanning circuit causes the signal PRES to be input to the pixel portions 11 in the third row to be at a low level. Accordingly, the reset transistors 405 of the pixel portions 11 in the third row are turned OFF. Thus, resetting of the FD portions 403 is cancelled. Each amplification transistor 404 outputs an N signal based on the potential of the FD portion 403 at which the resetting has been cancelled to the signal line 803 illustrated in FIG. 8. Accordingly, N signals are output from the pixel portions 11 in the third row to the signal lines 803 in the respective columns. Accordingly, the N signals corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns are input to the MPX circuit 804 a during the same period.

At and after time t3, the MPX circuit 804 a sequentially connects the signal lines 803 corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns to the ADC circuit 805 a in accordance with signals MPX supplied from the TG 113.

The ADC circuit 805 a AD-converts the N signal of the signal line 803 in the first column corresponding to the pixel portion 11 in the third row, output from the MPX circuit 804 a, into a digital signal. After that, the ADC circuit 805 a sequentially AD-converts the N signals output to the signal lines 803 corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns into digital signals. Because each N signal has already been input to the MPX circuit 804 a, high-speed AD conversion can be performed only by switching an output of the MPX circuit 804 a. In this embodiment, a period from time t3 corresponds to an N signal AD conversion period.

In addition, at time t3, the vertical scanning circuit causes the signals PTXA and PTXB to be output to the pixel portions 11 in the first row to be at a high level. Accordingly, the charges (in this embodiment, electrons) stored in the PDs 401 a and 401 b are transferred to the FD portion 403 via the transfer transistors 402 a and 402 b. In the FD portion 403, the charges of the PDs 401 a and 401 b are added. Accordingly, the potential of the FD portion 403 becomes a potential corresponding to the charge obtained by adding the charges of the PDs 401 a and 401 b. It is assumed that a signal output from the amplification transistor 404 on the basis of the potential of the FD portion 403 determined by the charge of only the PD 401 a is defined as an A signal. It is also assumed that a signal output from the amplification transistor 404 on the basis of the potential of the FD portion 403 determined by the charge of only the PD 401 b is defined as a B signal. In accordance with these assumptions, the signal output from the amplification transistor 404 on the basis of the potential of the FD portion 403 corresponding to the charge obtained by adding the charges of the PDs 401 a and 401 b can be defined as an A+B signal, which is the sum of the A signal and the B signal. The A+B signal of the pixel portion 11 in the first row is output to the signal line 803 in each column. Accordingly, the A+B signals corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns are input to the MPX circuit 804 a during the same period. The A+B signal is a second signal based on signals generated by a plurality of PDs. The second signal can be used as a signal for image capturing. In this embodiment, a period from time t3 corresponds to an A+B signal readout period.

At and after time t4, the MPX circuit 804 a sequentially connects the signal lines 803 corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns to the ADC circuit 805 a in accordance with signals MPX supplied from the TG 113.

The ADC circuit 805 a AD-converts the A+B signal of the signal line 803 in the first column corresponding to the pixel portion 11 in the first row, output from the MPX circuit 804 a, into a digital signal. After that, the ADC circuit 805 a sequentially AD-converts the A+B signals output to the signal lines 803 corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns into digital signals. Because each A+B signal has already been input to the MPX circuit 804 a, high-speed AD conversion can be performed only by switching an output of the MPX circuit 804 a. In this embodiment, a period from time t4 corresponds to an A+B signal AD conversion period.

At time t4, the vertical scanning circuit causes the signals PTXA and PTXB to be output to the pixel portions 11 in the third row to be at a high level. Accordingly, the A+B signals of the pixel portions 11 in the third rows are output to the signal lines 803 in the individual columns. Accordingly, the A+B signals corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns are input to the MPX circuit 804 a during the same period. In this embodiment, a period from time t4 corresponds to an A+B signal readout period.

At and after time t5, the MPX circuit 804 a sequentially connects the signal lines 803 corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns to the ADC circuit 805 a in accordance with signals MPX supplied from the TG 113.

The ADC circuit 805 a AD-converts the A+B signal of the signal line 803 in the first column corresponding to the pixel portion 11 in the third row, output from the MPX circuit 804 a, into a digital signal. After that, the ADC circuit 805 a sequentially AD-converts the A+B signals output to the signal lines 803 corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns into digital signals. Because each A+B signal has already been input to the MPX circuit 804 a, high-speed AD conversion can be performed only by switching an output of the MPX circuit 804 a. In this embodiment, a period from time t5 corresponds to an A+B signal AD conversion period.

These operations are performed in parallel on the second and fourth rows provided with G color filters. Furthermore, these operations are also performed on the pixel portions 11 located in the even columns. As a result of performing the operations on the individual pixel blocks 12 in parallel or sequentially, image signals of one screen can be obtained. In the case of obtaining an A signal or a B signal, control is not performed on the signal PTXA or the signal PTXB at the timing of reading out an A+B signal. Although the details will be described in another embodiment, it is preferable to read the signal after reading out the N signal and before reading out the A+B signal.

Now, one characteristic effect of this embodiment will be described.

In the operation illustrated in FIG. 9, a plurality of operations are performed in parallel as follows.

(1) A parallel operation of AD conversion of N signals corresponding to the pixel portions 11 in the first row and readout of N signals corresponding to the pixel portions 11 in the third row

(2) A parallel operation of AD conversion of N signals corresponding to the pixel portions 11 in the third row and readout of A+B signals corresponding to the pixel portions 11 in the first row

(3) A parallel operation of AD conversion of A+B signals corresponding to the pixel portions 11 in the first row and readout of A+B signals corresponding to the pixel portions 11 in the third row

These parallel operations can shorten the waiting time from when the ADC circuit 805 a ends AD conversion to when the ADC circuit 805 a performs the next AD conversion. Accordingly, the period required for AD conversion of signals output from all the pixel portions 11 can be shortened. Thus, the frame rate in the entire image capturing apparatus 100 can be increased.

In the example in FIG. 9, each N signal readout period and each A+B signal readout period are controlled during the same period in the signal lines 803 connected to the same MPX circuit 804, but the operation is not limited thereto. An important feature is that, during the same period as the period when an ADC circuit 805 performs AD conversion on each signal, a readout operation for other signal lines 803 connectable to the ADC circuit 805 is started. That is, it is preferable to appropriately change the readout timing or the readout and AD conversion timings for each signal line 803 in accordance with image capturing conditions (ISO speed and frame rate) or the property of the image sensor 106. For example, signals are sequentially AD-converted during each AD conversion period starting from time t2 and time t4, but the AD conversion timing varies between the first column and another column. The readout periods do not need to end simultaneously and only need to end by the AD conversion timing. Thus, although the readout periods of the individual columns simultaneously end at time t2 and time t4 in FIG. 9, the readout periods of the individual columns may be deferred in accordance with the AD conversion timings. More specifically, the end timing of the readout period of the third column is set to be immediately before the end of AD conversion of the first column. Also, the end timings of the readout periods of the other columns can be set to be immediately before the end of AD conversion. With this operation with such timings, AD conversion can be performed immediately after readout of signals, and a wasted time until the start of AD conversion can be shortened.

The ends of readout periods have been described above, and the same applies to the start. In particular, in a case where the end timings of readout periods change, it is preferable to change the start timings of the readout periods such that the lengths of readout periods of individual columns are substantially equal. Furthermore, although the readout periods simultaneously start at time t1 and time t3 in FIG. 9, for example, the starts of the readout periods can be advanced to the time points at which the signals MPX (Col_xN) corresponding to the AD conversion periods in individual columns have fallen. That is, it is not necessary to wait for the end of AD conversion in all the columns, and it is possible to start reading out the next signal at the timing when the AD conversion period for each column ends. Accordingly, the frame rate can be further increased. In a case where the readout periods for a plurality of signal lines 803 are not the same but are different, the load on the current sources 802 can be reduced. That is, to individually perform readout operations on the corresponding pixel portions 11 at different timings, the signal PRES and the signals PTXA and PTXB require a plurality of wiring lines for each row. This makes control complicated, but an effect of reducing peak consumption current supplied to the image sensor 106 can be obtained, and power consumption can be reduced as a whole. It is preferable to appropriately change timings for the individual signal lines 803, but the timings may be changed in units of a predetermined number of signal lines 803 to avoid excessive complexity of the circuit.

Next, a characteristic readout operation of the image sensor 106 in the image capturing apparatus 100 according to this embodiment will be described with reference to FIG. 10. FIG. 10 is a diagram illustrating an addition-and-readout operation of the image sensor 106. In the operation in FIG. 10, signals are sequentially read out from the pixel portions 11, with the signals being added before AD conversion. This addition-and-readout operation is used mainly in the case of obtaining a moving image. In FIG. 10, a description will be given of the case of not outputting signals for focus detection but outputting only signals for image capturing. The signal lines illustrated in FIG. 10 are the same as those in FIG. 9. Furthermore, the description of an operation common to the normal readout operation will be omitted.

At time t2, the vertical scanning circuit causes the signal PRES to be output to the pixel portions 11 in the first row to be at a low level. Accordingly, N signals are output from the pixel portions 11 to the signal lines 803 in the individual columns. Accordingly, the N signals corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns are input to the MPX circuit 804 a during the same period.

At and after time t2, the MPX circuit 804 a sequentially connects the signal lines 803 corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns to the ADC circuit 805 a in accordance with signals MPX supplied from the TG 113. In the addition-and-readout operation, unlike in the normal readout operation, a plurality of signal lines 803 are simultaneously connected to the ADC circuit 805 a. With this operation, an output of the MPX circuit 804 a becomes substantially equivalent to a signal obtained by adding and averaging the signals output to the signal lines 803 connected simultaneously. Accordingly, signals can be added among the signal lines 803. In this embodiment, to add two adjacent columns of the same color, such as the first column and the third column, the corresponding signal lines 803 are simultaneously connected to the ADC circuit 805 a. Accordingly, the number of times of necessary AD conversion becomes half that in the normal readout operation. As a whole, AD conversion can be completed in half the time of AD conversion in the normal readout operation. In this embodiment, the signal lines 803 and the MPX circuit 804 correspond to an adder circuit for adding signals from the pixel portions 11.

Furthermore, at the timing when AD conversion ends at or after time t2, the signal PSAVE to be output to each ADC circuit 805 is set to a high level. Accordingly, the ADC circuit 805 is switched to a power saving operation. At time t3, the signal PSAVE is set to a low level and the power saving operation ends. Accordingly, it becomes possible to perform AD conversion on the next signal.

In FIG. 10, the signal PSAVE is set to a high level at the timing when AD conversion of each row or each pixel block ends and corresponding to a horizontal blanking period. This enables further power saving. Because each ADC circuit 805 operates independently, it is not always necessary to perform a power saving operation in the entire image sensor 106. It is preferable to appropriately perform a power saving operation in accordance with the operation of each ADC circuit 805.

As a result of adding signals by using the MPX circuit 804 provided in the preceding stage of the ADC circuit 805, the time required for AD conversion can be shortened. In addition, as a result of causing the ADC circuit 805 to perform a power saving operation in the shortened time, power saving of the entire image sensor 106 can be realized with the frame rate being maintained. Although signals in two columns are added in this embodiment, signals in three or more columns may be added. By increasing the number of columns for which the signals are added, the AD conversion time can be further shortened and the power can be further saved. Furthermore, the frame rate can be increased.

In the case of providing a sample hold circuit between the signal lines 803 and the MPX circuit 804, it is not necessary to simultaneously connect a plurality of signal lines 803 to the MPX circuit 804 at the time of adding signals. For example, addition of signals can be performed by further providing a switch circuit or the like for connecting capacitances (capacitors or the like) holding signals in the sample hold circuit. In addition, an addition-and-readout operation may be performed by combining a signal addition method of connecting capacitances and an addition method of simultaneously connecting a plurality of signal lines 803 to the MPX circuit 804.

Although an operation of adding signals of the same color has been described in this embodiment, signals of different colors may be added. Signals of different colors can be used as signals for AF or exposure calculation other than generation of an image signal.

Although each timing chart illustrates only readout timings, each PD 401 in each pixel portion 11 is reset before the readout timings. To make the storage period uniform in an entire screen, scanning for each pixel portion 11 in the reset operation is performed in accordance with the readout timing described in this embodiment.

Second Embodiment

In the first embodiment, an example has been given in which addition of signals in the column direction is performed by simultaneously connecting a plurality of signal lines 803 connected to the MPX circuit 804 to the ADC circuit 805. In this embodiment, an example of connection between the signal lines 803 and the MPX circuit 804 different from the first embodiment will be given, and an operation of adding signals also in the row direction will be described.

A readout circuit for reading out signals from the individual pixel portions 11 in the image sensor 106 according to this embodiment will be described with reference to FIG. 11. FIG. 11 corresponds to FIG. 8 in the first embodiment and illustrates an equivalent circuit about the readout circuit of the image sensor 106. The same components as those in FIG. 8 are denoted by the same reference numerals, and the description thereof will be omitted.

In FIG. 11, the signals output from the individual pixel portions 11 are read out through the signal lines 803. Each column of the pixel portions 11 has four signal lines 803. The individual signal lines are represented by col_xN (x: the column number of the pixel portions 11, N: A, B, C, or D). The signal lines 803 are arranged in the same manner as those for the pixel portions 11 in the first column also in the other columns. The circuit in FIG. 11 is different from the circuit according to the first embodiment in the manner of connection between the signal lines 803 and the MPX circuit 804. Specifically, although each column of the pixel portions 11 has four signal lines 803 in this embodiment, the configuration is not limited thereto. To achieve higher-speed readout, it is preferable to provide more signal lines 803. Note that the number of signal lines is preferably a multiple of 2 or 4, or a multiple of the number of signals to be added.

In FIG. 11, the signals of the pixel portions 11 that have R color filters and that are located in the first and third rows and in the odd columns among the first to twelfth columns are input to the MPX circuit 804 and the ADC circuit 805. Furthermore, the signals of the pixel portions 11 that have G color filters and that are located in the second and fourth rows and in the odd columns among the first to twelfth columns are input thereto. In FIG. 11, only the odd columns that are necessary for description are illustrated, and the illustration of the other odd columns and the even columns is omitted for simplicity.

FIG. 12 is a diagram illustrating an addition-and-readout operation of the image sensor 106 in the second embodiment. In the operation in FIG. 12, signals are sequentially read out from the pixel portions 11, with the signals being added before AD conversion. This addition-and-readout operation is used mainly in the case of obtaining a moving image. In FIG. 12, a description will be given of the case of not outputting signals for focus detection but outputting only signals for image capturing. In FIG. 12, the signal lines are the same as those in FIG. 10, and only the signals input to the MPX circuit 804 are different. Furthermore, the description of an operation common to the operation illustrated in the first embodiment will be omitted.

At time t2, the vertical scanning circuit causes the signal PRES to be output to the pixel portions 11 in the first row and the signal PRES to be output to the pixel portions 11 in the third row to be at a low level. Accordingly, N signals are output from the pixel portions 11 to the signal lines 803 in the individual columns. Accordingly, the N signals corresponding to the pixel portions 11 in the first and third rows and in the odd columns among the first to twelfth columns are input to the MPX circuit 804.

At and after time t2, the MPX circuit 804 sequentially connects the signal lines 803 corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns to the ADC circuit 805 in accordance with signals MPX supplied from the TG 113. In the addition-and-readout operation in this embodiment, a plurality of signal lines 803 are simultaneously connected to the ADC circuit 805. Specifically, Col_xA corresponding to the pixel portions 11 in the first row and Col_xC corresponding to the pixel portions 11 in the third row are simultaneously connected. With this operation, an output of the MPX circuit 804 is a signal obtained by adding and averaging the signals output to the signal lines 803 connected simultaneously, and addition of signals in the row direction can be performed. In this embodiment, to add two adjacent rows of the same color, such as the first row and the third row, the corresponding signal lines 803 need to be simultaneously connected to the ADC circuit 805. Accordingly, a signal corresponding to AD conversion for two rows can be obtained by performing AD conversion once, and AD conversion can be completed in half the time of AD conversion in the normal readout operation.

Furthermore, at the timing when AD conversion ends at or after time t2, the signal PSAVE to be output to each ADC circuit 805 is set to a high level. Accordingly, the ADC circuit 805 is switched to a power saving operation. Immediately before time t3, the signal PSAVE is set to a low level and the power saving operation ends. Accordingly, it becomes possible to perform AD conversion on the next signal.

In this embodiment, an operation of performing only addition in the row direction has been illustrated. By combining the addition-and-readout operation in the column direction as illustrated in the first embodiment, it becomes possible to simultaneously perform addition in both the row direction and the column direction.

As a result of enabling the connection from the pixel portions 11 corresponding to the columns or rows as a target of addition to the MPX circuit 804 provided before the ADC circuit 805, both the normal readout operation and the addition-and-readout operation can be performed. Furthermore, as a result of causing the ADC circuit 805 to perform a power saving operation in a time in which the AD conversion time is shortened, power saving of the entire image sensor 106 can be realized with the frame rate being maintained. Although signals in two rows are added in this embodiment, signals in three or more rows may be added. Alternatively, addition in the column direction may be combined. In that case, the number of columns as a target of addition need not necessarily be the same as the number of rows as a target of addition.

FIG. 6 illustrates an example in which one signal processing unit 21 is disposed for one pixel block 12 including a predetermined number of pixel portions 11. The pixel portions 11 included in the pixel block 12 need not necessarily be adjacent to each other. For example, in consideration of the color center of gravity (sampling cycle) after addition of pixels of the same color, the block formed of the pixel portions 11 represented by solid lines in FIG. 13 may be regarded as the pixel block 12, and the signal lines 803 from the individual pixel portions 11 may be connected to one MPX circuit 804. As a result of adopting the pixel block illustrated in FIG. 13, the color centers of gravity after addition can be matched in the column direction in the case of adding signals of three pixels in the column direction. Also, matching of the color centers of gravity can be achieved in the vertical direction by a similar disposition in the vertical direction.

Third Embodiment

In the first embodiment and the second embodiment, a description has been given of control of adding signals in the MPX circuit 804 to shorten an AD conversion time and causing the ADC circuit 805 to perform a power saving operation during that time. In this embodiment, a description will be given of control of a power saving operation for the ADC circuit 805 that is not used during an addition-and-readout operation. The MPX circuit 804 performs addition of signals also in this embodiment.

A readout circuit for reading out signals from the individual pixel portions 11 in the image sensor 106 according to this embodiment will be described with reference to FIG. 14. FIG. 14 corresponds to FIG. 8 in the first embodiment and illustrates an equivalent circuit about the readout circuit of the image sensor 106. The same components as those in FIG. 8 are denoted by the same reference numerals.

In FIG. 14, the signals output from the individual pixel portions 11 are read out through the signal lines 803. Each column of the pixel portions 11 has four signal lines 803. The individual signal lines are represented by col_xN (x: the column number of the pixel portions 11, N: A, B, C, or D). The signal lines 803 are arranged in the same manner as those for the pixel portions 11 in the first column also in the other columns. The circuit in FIG. 14 is different from the circuits according to the first embodiment and the second embodiment in an MPX circuit 1404 and a PSAVE control unit 1406 added to the configuration of the signal processing unit 21.

In FIG. 14, the signals of the pixel portions 11 that have R color filters and that are located in the first and third rows and in the odd columns among the first to twelfth columns are input to the MPX circuit 804 a. Also, the signals of the pixel portions 11 that have G color filters and that are located in the second and fourth rows and in the odd columns among the first to twelfth columns are input to the MPX circuit 804 b. An output of the MPX circuit 804 a and an output of the MPX circuit 804 b are input to the MPX circuit 1404. An output of the MPX circuit 1404 is controlled on the basis of a signal MPX2, which is a control signal, and a switching operation to output either the output of the MPX circuit 804 a or the output of the MPX circuit 804 b to the ADC circuit 805 a is performed. Specifically, the output of the MPX circuit 804 a is output in a case where the signal MPX2 is at a low level, and the output of the MPX circuit 804 b is output in a case where the signal MPX2 is at a high level. With this operation, the output of the MPX circuit 804 a and the output of the MPX circuit 804 b can be AD-converted by the single ADC circuit 805 a.

In addition, the output of the MPX circuit 804 b is input to the ADC circuit 805 b, which AD-converts the output of the MPX circuit 804 b. However, in the case of AD-converting the output of the MPX circuit 804 a and the output of the MPX circuit 804 b by using the single ADC circuit 805 a in the above-described manner, it is not necessary to cause the ADC circuit 805 b to operate.

In addition, the ADC circuits 805 according to this embodiment are each capable of individually performing a power saving operation. To control the power saving operation, the second substrate 20 is provided with the PSAVE control unit 1406. In accordance with individual control signals (PSAVE1 and PSAVE2) from the PSAVE control unit 1406, the ADC circuit 805 a and the ADC circuit 805 b start or stop a power saving operation. Thus, in a case where only the ADC circuit 805 a performs an AD conversion operation, it is possible to cause only the ADC circuit 805 b to perform a power saving operation by using the signal PSAVE2.

FIG. 15 is a diagram illustrating an addition-and-readout operation of the image sensor 106 in the third embodiment. In the operation in FIG. 15, signals are sequentially read out from the pixel portions 11, with the signals being added before AD conversion. This addition-and-readout operation is used mainly in the case of obtaining a moving image. In FIG. 15, a description will be given of the case of not outputting signals for focus detection but outputting only signals for image capturing. The signal lines illustrated in FIG. 15 include, in addition to those in FIG. 10 and so forth, signal lines for the signal MPX2 for controlling the MPX circuit 1404 and the signals PSAVE1 and PSAVE2 from the PSAVE control unit 1406. Furthermore, the description of an operation common to the operations illustrated in the first embodiment and the second embodiment will be omitted.

At time t2, the vertical scanning circuit causes the signal PRES to be output to the pixel portions 11 in the first and second rows to be at a low level. Accordingly, N signals are output from the pixel portions 11 to the signal lines 803 in the individual columns. Accordingly, the N signals corresponding to the pixel portions 11 in the first and second rows and in the odd columns among the first to twelfth columns are input to the MPX circuit 804 a and the MPX circuit 804 b.

At and after time t2, the MPX circuit 804 sequentially connects the signal lines 803 corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns to the ADC circuit 805 a in accordance with signals MPX and a signal MPX2 supplied from the TG 113. In the addition-and-readout operation in this embodiment, a plurality of signal lines 803 are simultaneously connected to the ADC circuit 805 a. Specifically, Col_1A corresponding to the pixel portion 11 in the first row and the first column and Col_3A corresponding to the pixel portion 11 in the first row and the third column are simultaneously connected to the MPX circuit 804 a. With this operation, an output of the MPX circuit 804 a is a signal obtained by adding and averaging the signals output to the signal lines 803 connected simultaneously, and addition of signals in the column direction can be performed. At the same timing, the signal MPX2 is controlled to a low level, and an output of the MPX circuit 804 a is input to the ADC circuit 805 a as an output of the MPX circuit 1404.

Furthermore, at the timing when AD conversion for the first and third columns ends at or after time t2, Col_1B corresponding to the pixel portion 11 in the second row and the first column and Col_3B corresponding to the pixel portion 11 in the second row and the third column are simultaneously connected to the MPX circuit 804 b. With this operation, an output of the MPX circuit 804 b is a signal obtained by adding and averaging the signals output to the signal lines 803 connected simultaneously, and addition of signals in the column direction can be performed. At the same timing, the signal MPX2 is controlled to a high level, and an output of the MPX circuit 804 b is input to the ADC circuit 805 a as an output of the MPX circuit 1404.

As a result of performing the addition-and-readout operation by repeating the above-described operation, an AD conversion operation for two rows can be completed in the time for one row in the normal readout operation. That is, two ADC circuits 805 are required in the normal readout operation, whereas one ADC circuit 805 is enough to read out signals from the entire pixel block 12. Thus, the ADC circuit 805 b that has become unnecessary can always perform a power saving operation during the addition-and-readout operation in accordance with the signal PSAVE2 controlled to a high level, and power consumption can be significantly reduced.

Also in this embodiment, as in the second embodiment, power can be further saved by controlling the signal PSAVE to a high level at the time point when the AD conversion operation in the ADC circuit 805 a has finished.

As a result of providing a plurality of MPX circuits in the signal processing unit 21, it is possible to provide an ADC circuit that is not required to be operated during an addition-and-readout operation. In addition, as a result of causing the ADC circuit to perform a power saving operation, power saving of the entire image sensor 106 can be achieved, with the frame rate being maintained. Although signals in two columns are added in this embodiment, signals in three or more columns may be added. Alternatively, addition in the row direction may be combined. In that case, the number of columns as a target of addition need not necessarily be the same as the number of rows as a target of addition.

In this embodiment, the AD conversion time is shortened by adding signals of a plurality of signal lines 803. The AD conversion time can be shortened also by combining a thinning operation. For example, in the embodiment, only the signals of the signal lines 803 in the first, fifth, and ninth columns may be read out at predetermined timings illustrated in FIG. 15, without connecting the signal lines 803 in the third, seventh, and eleventh columns.

Furthermore, in the case of performing thinned-out reading, the MPX circuit 1404 may be omitted by devising the connection between the signal lines 803 and the MPX circuit 804. As an example, the signal lines 803 from the pixel portions 11 as a target to be thinned out (for example, the pixel portions 11 in the third, seventh, and eleventh columns) are connected to the MPX circuit 804 b. The signal lines 803 from the pixel portions 11 as a target of readout (for example, the pixel portions 11 in the first, fifth, and ninth columns) are connected to the MPX circuit 804 a. With such connections, the MPX circuit 804 b and the ADC circuit 805 b save power during thinned-out reading, and accordingly an effect similar to that of the third embodiment can be obtained.

In the first to third embodiments, signals are read out first from the pixel portions 11 located at an end of the pixel block 12 (for example, the first column), but the signal readout order is not limited thereto. For example, signals may be read out in a reversed order or signals may be read out from alternate pixel portions.

Fourth Embodiment

In the first embodiment to the third embodiment, examples have been given in which the power saving operation of the ADC circuit 805 is controlled when an AD conversion operation is not performed during a readout period while the MPX circuit 804 is performing signal addition or the like. However, in an operation of the image capturing apparatus 100 using the image sensor 106, a power saving operation can be set to the ADC circuit 805 at another timing.

FIG. 16 illustrates timings in the case of capturing one image by the image capturing apparatus 100. A signal VD is a vertical synchronization signal and is supplied from the TG 113 to the image sensor 106. The signal VD is also supplied to other components, such as the DFE 108 and the DSP 109, and synchronizes the operation timing of the entire image capturing apparatus 100. The cycle of the signal VD corresponds to the frame rate for obtaining a moving image, and is 1/120 seconds in this embodiment. An internal HD is a horizontal synchronization signal, which is an internal signal generated by a circuit in the image sensor 106 in synchronization with the signal VD supplied from the TG 113. The operation timings of the image sensor 106 are specified by the internal HD, for example, a reset operation and a readout operation for the pixel portions 11 are controlled. The image sensor 106 outputs signals from the pixel portions 11 corresponding to a predetermined number of rows during one HD period. In this embodiment, the time required for the image sensor 106 to output image signals of one frame (a readout period) is 1/180 seconds.

As illustrated in FIG. 16, in a case where the readout period required to obtain one image is 1/180 seconds, the readout speed is sufficiently high relative to the frame rate, and thus the residual time is a blanking period. Neither signal readout nor AD conversion is performed during the blanking period. Thus, a power saving operation can be performed during this period. As illustrated in FIG. 16, the signal PSAVE is set to a high level during the blanking period, and accordingly a power saving operation can be achieved.

A constant frame rate is required to obtain a smooth moving image. In a case where the frame rate is not variable but is constant, the blanking period depends on the amount of signals read out from the image sensor 106. For example, assume the case of obtaining a still image while capturing a moving image having a predetermined frame rate (for example, 60 fps), as illustrated in FIG. 17. It is assumed that, in a case where 8 million pixels are required for a moving image, four times the pixels, 32 million pixels, are used for a still image. In this case, the blanking period is inevitably shorter during still image capturing than during moving image capturing. In such a case, it is preferable to perform a power saving operation only during the blanking periods of moving image capturing and not to perform a power saving operation during still image capturing, as illustrated in FIG. 17. A moving image is continuously captured whereas a still image is instantaneously captured. Thus, even if a power saving operation is not performed during still image capturing, power saving can be achieved in the entire image sensor 106.

In a storage period, as in a blanking period, neither signal readout nor AD conversion is performed. As illustrated in FIG. 18A, the image sensor 106 resets the pixel portions 11 and is then exposed during a predetermined storage period. After that, signals area read out during a readout period. The storage period is determined by a user or automatically on the basis of the brightness of a subject, and the period is specified by the signal VD or the internal HD. The image sensor 106 according to this embodiment is capable of setting a power saving operation also in the storage period.

In a case where the storage period is short (for example, about 1/1000 seconds) as illustrated in FIG. 18B, the period for which a power saving operation can be set is short, and thus control is performed not to set a power saving operation in consideration of an influence of recovery from the power saving operation. As an example, it is preferable to set a power saving operation for a storage period in a case where the storage period is ⅛ seconds to 1 second or more.

Fifth Embodiment

In the fourth embodiment, a description has been given of the timing to perform a power saving operation of the ADC circuit 805 in an image capturing operation in the image capturing apparatus 100 including the image sensor 106. In this embodiment, a detailed description will be given of an operation of performing a power saving operation by dividing a region in the circuit array of the image sensor 106.

FIG. 19A and FIG. 19B illustrate a circuit array formed in the second substrate 20 of the image sensor 106. Each element of the circuit array corresponds to the signal processing unit 21, and n×m signal processing units 21 are disposed in the horizontal and vertical directions. FIG. 19A illustrates a normal image capturing state, in which signals are read out by using the entire circuit array to obtain an image by using the entire screen. Thus, all the signal processing units 21 are set to perform a normal operation. On the other hand, FIG. 19B illustrates a clipped image capturing state (image capturing using only horizontal i-k columns and vertical h-j rows), in which an image is obtained by using only a central portion of the screen and not using the peripheral portion of the circuit array. Thus, the signal processing units 21 at the peripheral portion are set to perform a power saving operation in the clipped image capturing state.

A circuit configuration for performing a power saving operation in units of regions in this embodiment will be described with reference to FIGS. 20 and 21. FIG. 20 is a diagram illustrating the wiring layout of supply lines for a signal PSAVE. In this embodiment, the signal PSAVE is supplied to the individual signal processing units 21 through PSAVE_H(n) (n: column number) for horizontal control and PSAVE_V(m) (m: row number) for vertical control. PSAVE_H(n) and PSAVE_V(m) are connected by a driver circuit that is not illustrated and are controlled by a timing signal or the like from the TG 113.

A readout circuit for reading out signals from the individual pixel portions 11 in the image sensor 106 will be described with reference to FIG. 21. FIG. 21 illustrates an equivalent circuit about the readout circuit of the image sensor 106 according to the fifth embodiment. FIG. 21 corresponds to FIG. 8 in the first embodiment. The same components as those in FIG. 8 are denoted by the same reference numerals.

In FIG. 21, the signals output from the individual pixel portions 11 are read out through the signal lines 803. Each column of the pixel portions 11 has four signal lines 803. The circuit in FIG. 21 is different from the circuit according to the first embodiment in a PSAVE control unit 2106. PSAVE_H(n) and PSAVE_V(m) described using FIG. 20 are input to the PSAVE control unit 2106. The PSAVE control unit 2106 includes an AND circuit, and controls the ADC circuit 805 to perform a power saving operation when supplied with a high-level signal from either PSAVE_H(n) or PSAVE_V(m). By using PSAVE_H(n) and PSAVE_V(m) in this manner, any of the signal processing units 21 in the circuit array can be controlled to perform a power saving operation. To enable easier control of a power saving operation in a region within the circuit array, it is preferable to provide the signal processing unit 21 with a latch circuit that is not illustrated. This makes it possible to store, in the latch, that high-level signals have been supplied from both PSAVE_H(n) and PSAVE_V(m) and control of a power saving operation has been performed, and to maintain the state until the latch is reset. Accordingly, it is not necessary to constantly supply a high-level signal to PSAVE_H(n) and PSAVE_V(m) corresponding to the signal processing unit 21 to be controlled to perform a power saving operation, and a region can be selected with a higher degree of freedom. As an example, a power saving operation can be controlled in a plurality of regions in the pixel array. The number of wiring lines of PSAVE_H(n) or PSAVE_V(m) may be increased to control a power saving operation with a higher degree of freedom.

Sixth Embodiment

FIG. 22 is a diagram illustrating a signal readout operation for focus detection in addition to a normal readout operation of the image sensor 106. In the operation in FIG. 22, signals are sequentially read out from the pixel portions 11 without adding the signals. In FIG. 22, a description will be given of the case of outputting signals for focus detection and signals for image capturing. That is, each pixel portion 11 outputs a first signal based on a signal of one of the plurality of PDs, and also outputs a second signal based on signals of the plurality of PDs. The signal lines illustrated in FIG. 22 are the same as those in FIG. 9. Furthermore, the description of an operation common to the operation according to the first embodiment will be omitted.

At time t3, the vertical scanning circuit causes only the signal PTXA to be output to the pixel portions 11 in the first row to be at a high level. Accordingly, the charge stored in the PD 401 a is transferred to the FD portion 403 via the transfer transistor 402 a. Accordingly, the potential of the FD portion 403 becomes a potential corresponding to the PD 401 a. Subsequently, the amplification transistor 404 outputs an A signal on the basis of the potential of the FD portion 403 determined by only the charge of the PD 401 a. The A signals of the pixel portions 11 in the first row are output to the signal lines 803 in the individual columns. Accordingly, the A signals corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns are input to the MPX circuit 804 a during the same period. In this embodiment, a period from time t3 corresponds to an A signal readout period.

At and after time t4, the MPX circuit 804 a sequentially connects the signal lines 803 corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns to the ADC circuit 805 a in accordance with signals MPX supplied from the TG 113.

The ADC circuit 805 a AD-converts the A signal of the signal line 803 in the first column corresponding to the pixel portion 11 in the first row, output from the MPX circuit 804 a, into a digital signal. After that, the ADC circuit 805 a sequentially AD-converts the A signals output to the signal lines 803 corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns into digital signals. Because each A signal has already been input to the MPX circuit 804 a, high-speed AD conversion can be performed only by switching an output of the MPX circuit 804 a. In this embodiment, a period from time t4 corresponds to an A signal AD conversion period.

At time t4, the vertical scanning circuit causes only the signal PTXA to be output to the pixel portions 11 in the third row to be at a high level. Accordingly, the charge stored in the PD 401 a is transferred to the FD portion 403 via the transfer transistor 402 a. Accordingly, the potential of the FD portion 403 becomes a potential corresponding to the PD 401 a. Subsequently, the amplification transistor 404 outputs an A signal on the basis of the potential of the FD portion 403 determined by only the charge of the PD 401 a. The A signals of the pixel portions 11 in the third row are output to the signal lines 803 in the individual columns. Accordingly, the A signals corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns are input to the MPX circuit 804 a during the same period. In this embodiment, a period from time t4 corresponds to an A signal readout period.

At and after time t5, the MPX circuit 804 a sequentially connects the signal lines 803 corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns to the ADC circuit 805 a in accordance with signals MPX supplied from the TG 113.

The ADC circuit 805 a AD-converts the A signal of the signal line 803 in the first column corresponding to the pixel portion 11 in the third row, output from the MPX circuit 804 a, into a digital signal. After that, the ADC circuit 805 a sequentially AD-converts the A signals output to the signal lines 803 corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns into digital signals. In this embodiment, a period from time t5 corresponds to an A signal AD conversion period.

At time t5, the vertical scanning circuit causes the signals PTXA and PTXB to be output to the pixel portions 11 in the first row to be at a high level. Accordingly, the charges (electrons in this embodiment) stored in the PDs 401 a and 401 b are transferred to the FD portion 403 via the transfer transistors 402 a and 402 b. The FD portion 403 adds the charges of the PDs 401 a and 401 b. Accordingly, the potential of the FD portion 403 becomes a potential corresponding to the charge obtained by adding the charges of the PDs 401 a and 401 b at time t5, in addition to the charge of the PD 401 a transferred at time t3. The A+B signals of the pixel portions 11 in the first row have been output to the signal lines 803 in the individual columns. Accordingly, the A+B signals corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns are input to the MPX circuit 804 a during the same period. In this embodiment, a period from time t5 corresponds to an A+B signal readout period.

At and after time t6, the MPX circuit 804 a sequentially connects the signal lines 803 corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns to the ADC circuit 805 a in accordance with signals MPX supplied from the TG 113.

The ADC circuit 805 a AD-converts the A+B signal of the signal line 803 in the first column corresponding to the pixel portion 11 in the first row, output from the MPX circuit 804 a, into a digital signal. After that, the ADC circuit 805 a sequentially AD-converts the A+B signals output to the signal lines 803 corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns into digital signals. In this embodiment, a period from time t6 corresponds to an A+B signal AD conversion period.

At time t6, the vertical scanning circuit causes the signals PTXA and PTXB to be output to the pixel portions 11 in the third row to be at a high level. Accordingly, the charges (electrons in this embodiment) stored in the PDs 401 a and 401 b are transferred to the FD portion 403 via the transfer transistors 402 a and 402 b. The FD portion 403 adds the charges of the PDs 401 a and 401 b. Accordingly, the potential of the FD portion 403 becomes a potential corresponding to the charge obtained by adding the charges of the PDs 401 a and 401 b at time t6, in addition to the charge of the PD 401 a transferred at time t4. The A+B signals of the pixel portions 11 in the third row have been output to the signal lines 803 in the individual columns. Accordingly, the A+B signals corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns are input to the MPX circuit 804 a during the same period. In this embodiment, a period from time t6 corresponds to an A+B signal readout period.

At and after time t7, the MPX circuit 804 a sequentially connects the signal lines 803 corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns to the ADC circuit 805 a in accordance with signals MPX supplied from the TG 113.

The ADC circuit 805 a AD-converts the A+B signal of the signal line 803 in the first column corresponding to the pixel portion 11 in the third row, output from the MPX circuit 804 a, into a digital signal. After that, the ADC circuit 805 a sequentially AD-converts the A+B signals output to the signal lines 803 corresponding to the pixel portions 11 in the odd columns among the first to twelfth columns into digital signals. In this embodiment, a period from time t7 corresponds to an A+B signal AD conversion period.

As a result of reading out A signals before reading out A+B signals, both signals for focus detection and signals for an image can be read out. The B signal used for focus detection is calculated by reading out an A signal and an A+B signal and performing subtraction on both the signals.

Seventh Embodiment

In the first embodiment to the third embodiment, examples of the internal configuration of the image sensor 106 have been described. To read out signals from the pixel portions 11 at high speed, a plurality of circuits are arranged in parallel, and the individual circuits simultaneously perform readout operations. Meanwhile, an image sensor used in an image capturing apparatus represented by a single-lens reflex camera has a diagonal length of several centimeters. Thus, in-plane variation in a reference voltage level or the like inside the image sensor cannot be ignored. Also, variation in output may occur among the circuits arranged in parallel, because of variation in manufacturing or asymmetry of wiring lengths of the circuits. In this embodiment, a method for correcting the variation will be described. It is assumed that the readout circuit according to the first embodiment illustrated in FIG. 8 is used as a readout circuit in the image sensor 106. Examples of correction include offset correction and gain correction. As a correction parameter, a value stored in the ROM 119 or the like in advance may be used, or a value generated in real time immediately before or after reading out a signal may be used.

FIG. 23 illustrates one signal processing unit 21 and the pixel block 12 corresponding thereto. In the pixel block 12, as illustrated in FIG. 8, readout in the first and third rows in which the pixel portions 11 having R color filters are disposed and readout in the second and fourth rows in which the pixel portions 11 having G color filters are disposed are performed via different MPX circuits 804 and different ADC circuits 805. Thus, it is desired to perform correction by using a correction value for the first and third rows represented by “P” in FIG. 23 and another correction value for the second and fourth rows represented by “Q” in FIG. 23. This is because common circuit variations may occur in a periodical circuit. By periodically using the same correction value, the number of parameters to be used for correction can be reduced, and accordingly a processing load and power consumption can be reduced.

FIG. 24A and FIG. 24B illustrate a pixel array in the first substrate 10 and correction parameters corresponding thereto. As illustrated in FIG. 24A, the pixel array includes n×m pixel blocks 12 in the horizontal and vertical directions. The image sensor 106 according to this embodiment has a configuration in which the pixel blocks 12 adjacent to each other in the vertical direction have a common MPX circuit and a common ADC circuit. In this configuration, it is preferable that corresponding correction parameters be assigned to each unit formed of two pixel blocks 12 having the common circuit. FIG. 24B illustrates correction parameters corresponding to the individual units. One rectangle indicates one correction parameter. Each correction parameter includes correction parameters represented by P and Q for each row as described in FIG. 23.

Although FIG. 23 illustrates an example in which different correction parameters are provided in units of rows, the correction parameters are not limited thereto. As illustrated in FIG. 8, each column is provided with a plurality of (four in FIG. 8) signal lines 803. Thus, it is effective to provide correction parameters corresponding to the individual signal lines 803. FIG. 25 illustrates correction parameters corresponding to four signal lines A to D. As described by using FIG. 24A and FIG. 24B, each unit having a common ADC circuit has a correction parameter, and parameters different in the vertical direction are provided as illustrated in FIG. 25.

A description has been given of an example of providing correction parameters in accordance with the cycle of circuits constituting the image sensor 106. The correction parameters may be stored in a functional form instead of storing them for each pixel block. In a case where the cycle of the circuits is changed by an addition-and-readout operation or the like, it is preferable to switch the correction parameter in accordance with an operation mode. Alternatively, the correction parameter may be changed in accordance with image capturing conditions, such as ISO speed and exposure time. Although an example of providing correction parameters in accordance with a circuit cycle and performing correction has been described in this embodiment, a plurality of correction operations may be individually performed in each circuit cycle.

Eighth Embodiment

FIG. 26 is an equivalent circuit diagram of the ADC circuit 805 of the image sensor 106. The ADC circuit 805 includes an input terminal IN and an output terminal OUT, converts an analog signal Sin (an output of the MPX circuit 804) input from the input terminal IN into a digital signal Sout, and outputs the digital signal Sout from the output terminal OUT. The analog signal Sin may be one or both of the N signal and the A+B signal (S signal) described in the first embodiment. The ADC circuit 805 converts an output of the MPX circuit 804 into a digital signal Sout at a resolution of 5 bits.

The ADC circuit 805 further includes a generation circuit 810 that generates a comparison signal used for comparison with the analog signal Sin. The generation circuit 810 includes a plurality of capacitance elements cp0 to cp4 each having a capacitance value of a binary weight, and a plurality of switches sw0 to sw4 connected to the capacitance elements cp0 to cp4. The plurality of switches sw0 to sw4 constitute a switch circuit that selects one or more of the capacitance elements cp0 to cp4. The binary weight is a set of weights (capacitance values) forming a geometric progression of a common ratio of 2. In the example in FIG. 26, the capacitance elements cp0 to cp4 have capacitance values 1C, 2C, 4C, 8C, and 16C, respectively. One electrodes of the capacitance elements cp0 to cp4 are connected to a supply terminal SPL of the generation circuit 810, and the other electrodes thereof are connected to the switches sw0 to sw4, respectively. One ends of the switches sw0 to sw4 are connected to the capacitance elements cp0 to cp4, respectively, and the other ends thereof toggle between a terminal A and a terminal B. The terminal A is supplied with a ground potential GND, and the terminal B is supplied with a reference voltage VRF. The reference voltage VRF is a constant voltage supplied from the outside of the ADC circuit 805 and has a value larger than the ground potential GND. When the switch sw0 toggles to the terminal A, the ground potential GND is supplied to the capacitance element cp0. When the switch sw0 toggles to the terminal B, the reference voltage VRF is supplied to the capacitance element cp0. The same applies to the other switches sw1 to sw4. Switching of the switches sw0 to sw4 changes a combined capacitance value of the capacitance elements connected between the supply terminal SPL and the reference voltage VRF, and as a result, the value of a comparison signal Vcmp output from the supply terminal SPL is changed.

Furthermore, the supply terminal SPL of the generation circuit 810 is supplied with a ramp signal Vrmp from the outside of the ADC circuit 805 via a capacitance element cp5. The capacitance element cp5 is a capacitance element for adjusting the magnitude of the ramp signal Vrmp and has a capacitance value of 1C. That is, the capacitance value of the capacitance element cp5 is equal to the smallest capacitance value among the capacitance values of the capacitance elements cp0 to cp4 each having a capacitance value of a binary weight. A change in the value of the ramp signal Vrmp causes a change in the value of the comparison signal Vcmp output from the supply terminal SPL.

By combining a set of the capacitance elements connected between the supply terminal SPL and the reference voltage VRF and the value of the ramp signal Vrmp, the comparison signal Vcmp may have a certain value that is larger than or equal to the ground potential GND and smaller than or equal to the reference voltage VRF.

The ADC circuit 805 further includes a comparator 815. The comparator 815 compares the value of the analog signal Sin with the value of the comparison signal Vcmp and outputs a signal corresponding to a comparison result. The comparator 815 has a noninverting terminal supplied with the analog signal Sin via a capacitance element cp6, and has an inverting terminal supplied with the comparison signal Vcmp from the supply terminal SPL of the generation circuit 810. Accordingly, a high level is output in a case where the value of the analog signal Sin is larger than or equal to the value of the comparison signal Vcmp, and a low level is output in a case where the value of the analog signal Sin is smaller than the comparison signal Vcmp. In this example, a high level is output in a case where the value of the analog signal Sin is equal to the value of the comparison signal Vcmp. Alternatively, a low level may be output in this case. The capacitance element cp6 adjusts the value of the analog signal Sin to a range comparable with the comparison signal Vcmp. In this embodiment, to simplify the description, it is assumed that the value of the analog signal Sin is larger than or equal to the ground potential GND and is smaller than or equal to the reference voltage VRF, and that a signal having the same magnitude as the analog signal Sin is supplied to the noninverting terminal of the comparator 815.

In the example in FIG. 26, the analog signal Sin is supplied to the noninverting terminal of the comparator 815, and the comparison signal Vcmp is supplied to the inverting terminal of the comparator 815. As long as it is possible to determine which of the value of the analog signal Sin and the value of the comparison signal Vcmp is larger, another configuration may be adopted. For example, a difference between the analog signal Sin and the comparison signal Vcmp may be supplied to the noninverting terminal of the comparator 815, and the ground potential GND may be supplied to the inverting terminal of the comparator 815.

The ADC circuit 805 further includes switches sw5 and sw6. When these switches sw5 and sw6 are turned ON, the ground potential GND is supplied to the noninverting terminal and the inverting terminal of the comparator 815, and the comparator 815 is reset.

The ADC circuit 805 further includes a control circuit 820. The control circuit 820 is supplied with a comparison result from the comparator 815, generates a digital signal Sout on the basis of the comparison result, and outputs the digital signal Sout from the output terminal OUT. In addition, the control circuit 820 transmits control signals to the individual switches sw0 to sw6 to change the states thereof.

In FIG. 27, sw0 to sw6 represent the values of the control signals supplied from the control circuit 820 to the switches sw0 to sw6. Each of the switches sw0 to sw4 toggles to the terminal B when the control signal supplied thereto is at a high level and toggles to the terminal A when the control signal is at a low level. The switches sw5 and sw6 are turned ON when the control signal supplied thereto is at a high level and are turned OFF when the control signal is at a low level. On the lower side of FIG. 27, the analog signal Sin and the comparison signal Vcmp are illustrated. In FIG. 27, for example, it is assumed that the value of the analog signal Sin corresponds to 00110 in a binary number.

Next, an AD conversion operation by the ADC circuit 805 will be described in time sequence. In a preparatory period, the control circuit 820 causes the control signals to be supplied to the switches sw0 to sw4 to be at a low level, and causes the control signals to be supplied to the switches sw5 and sw6 to be at a high level. Accordingly, the noninverting terminal and the inverting terminal of the comparator 815 are reset to the ground potential GND, and the value of the comparison signal Vcmp becomes equal to the ground potential GND. After that, the control circuit 820 causes the control signals to be supplied to the switches sw5 and sw6 to be at a low level. In the operation performed thereafter, the noninverting terminal of the comparator 815 is continuously supplied with the analog signal Sin.

Subsequently, when a successive approximation period starts, the control circuit 820 changes the control signal to be supplied to the switch sw4 to a high level. Accordingly, the switch sw4 toggles to the terminal B, and the reference voltage VRF is applied to the supply terminal SPL of the generation circuit 810 via the capacitor cp4 having the largest capacitance value in the binary weight. As a result, the comparison signal Vcmp increases by VRF/2, and the value of the comparison signal Vcmp becomes equal to VRF/2. The control circuit 820 determines that the value of the analog signal Sin is smaller than the value of the comparison signal Vcmp (VRF/2) on the basis of a comparison result from the comparator 815, and changes the control signal to be supplied to the switch sw4 to a low level. Accordingly, the value of the comparison signal Vcmp is changed to the ground potential GND. This comparison result indicates that the MSB (the fifth bit in a case where the LSB is the first bit) of the value of the digital signal Sout is 0.

Next, the control circuit 820 changes the control signal to be supplied to the switch sw3 to a high level. Accordingly, the reference voltage VRF is applied to the supply terminal SPL of the generation circuit 810 via the capacitor cp3 having the second largest capacitance value in the binary weight. As a result, the comparison signal Vcmp increases by VRF/4, and the value of the comparison signal Vcmp becomes equal to VRF/4. The control circuit 820 determines that the value of the analog signal Sin is smaller than the value of the comparison signal Vcmp (VRF/4) on the basis of a comparison result from the comparator 815, and changes the control signal to be supplied to the switch sw3 to a low level. Accordingly, the value of the comparison signal Vcmp is changed to the ground potential GND. This comparison result indicates that the fourth bit of the value of the digital signal Sout is 0.

Next, the control circuit 820 changes the control signal to be supplied to the switch sw2 to a high level. Accordingly, the reference voltage VRF is applied to the supply terminal SPL of the generation circuit 810 via the capacitor cp2 having the third largest capacitance value in the binary weight. As a result, the comparison signal Vcmp increases by VRF/8, and the value of the comparison signal Vcmp becomes equal to VRF/8. The control circuit 820 determines that the value of the analog signal Sin is larger than the value of the comparison signal Vcmp (VRF/8) on the basis of a comparison result from the comparator 815, and keeps the control signal to be supplied to the switch sw2 at a high level. Accordingly, the value of the comparison signal Vcmp is kept at VRF/8. This comparison result indicates that the third bit of the value of the digital signal Sout is 1.

Next, the control circuit 820 changes the control signal to be supplied to the switch sw1 to a high level. Accordingly, the reference voltage VRF is applied to the supply terminal SPL of the generation circuit 810 via the capacitor cp1 having the fourth largest capacitance value in the binary weight and the capacitor cp2. As a result, the comparison signal Vcmp increases by VRF/16, and the value of the comparison signal Vcmp becomes equal to VRF*3/16. In this specification, “*” represents multiplication. The control circuit 820 determines that the value of the analog signal Sin is larger than the value of the comparison signal Vcmp (VRF*3/16) on the basis of a comparison result from the comparator 815, and keeps the control signal to be supplied to the switch sw1 at a high level. Accordingly, the value of the comparison signal Vcmp is kept at VRF*3/16. This comparison result indicates that the second bit of the value of the digital signal Sout is 1.

Finally, the control circuit 820 changes the control signal to be supplied to the switch sw0 to a high level. Accordingly, the reference voltage VRF is applied to the supply terminal SPL of the generation circuit 810 via the capacitor cp0 having the fifth largest capacitance value in the binary weight, and the capacitors cp1 and cp2. As a result, the comparison signal Vcmp increases by VRF/32, and the value of the comparison signal Vcmp becomes equal to VRF*7/32. The control circuit 820 determines that the value of the analog signal Sin is smaller than the value of the comparison signal Vcmp (VRF*7/32) on the basis of a comparison result from the comparator 815, and changes the control signal to be supplied to the switch sw0 to a low level. Accordingly, the value of the comparison signal Vcmp is changed to VRF*3/16. This comparison result indicates that the first bit of the value of the digital signal Sout is 0.

As a result of the foregoing successive approximation, the control circuit 820 determines that the digital signal Sout corresponding to the analog signal is 00110.

In this way, the ADC circuit 805 is capable of performing AD conversion for generating a digital signal corresponding to an analog signal input thereto.

A description has been given of an example of using a successive approximation ADC circuit as another AD conversion method. The ADC circuit 805 is not limited to this successive approximation ADC circuit. For example, ADC circuits of other types including a ramp signal comparison type, a delta-sigma type, a pipeline type, a flash type, and the like may be used.

Ninth Embodiment

In this embodiment, the details of the internal configuration of the image sensor 106 illustrated in FIG. 2 will be described. FIG. 28 is a functional block diagram illustrating the internal configuration of the image sensor 106. The image sensor 106 is a multilayer image sensor having a multilayer structure including the first substrate 10 and the second substrate 20, as illustrated in FIG. 2. The image sensor 106 according to this embodiment includes at least about 8000 effective pixels in the horizontal direction and about 6000 effective pixels in the vertical direction, and the first substrate 10 and the second substrate 20 have a characteristic that the dimension in the horizontal direction is longer than the dimension in the vertical direction.

A pixel array including a plurality of pixel portions 11 and a pixel driving unit 13 for supplying driving signals (signal PSEL, signal PTXA, signal PTXB, and signal PRES) to the individual pixels are disposed in the first substrate 10. The pixel driving unit 13 includes a scanning circuit that sequentially selects rows, columns, or pixel blocks 12, and a driver circuit or the like for generating each driving signal. The pixel array includes, in addition to effective pixels that receive incident light, light-shielded pixels shielded from light to calculate a black reference and dummy pixels. The light-shielded pixels are mainly disposed at a peripheral portion of the pixel array, for example, about 120 pixels are disposed in the vertical direction and about 180 pixels are disposed in the horizontal direction. The dummy pixels are pixels that do not have a photoelectric conversion unit, and output a signal for generating a correction value for offset removal of the circuit. The pixel driving unit 13 may include portions disposed on the left and right so as to sandwich the pixel array. Accordingly, an effect of increasing the drive capacity of each driving signal can be obtained. The second substrate 20 includes a circuit array including a plurality of signal processing units 21 and a power supply 22 for supplying power to each block of the image sensor 106. The power supply 22 includes a power control unit that controls a destination to which the power is supplied, and is capable of performing control to determine the block to which power is to be supplied. Also, the second substrate 20 includes a reference voltage generation unit 23 for supplying a reference voltage to the ADC circuit 805 included in each signal processing unit 21, and a PLL circuit 24 for supplying clock to each block. Furthermore, the second substrate 20 includes a vertical scanning circuit 25 that supplies a control signal to the pixel driving unit 13 disposed in the first substrate 10.

The individual signal processing units 21 are controlled by control signals from an internal TG 26. The control signals include a signal MPX to be supplied to the MPX circuit 804, a signal PSAVE to be supplied to the PSAVE control unit 806, and so forth. Also, there are provided a circuit driving unit 27 a and a circuit driving unit 27 b that input output control signals for sequentially driving the individual signal processing units 21 and that drive the individual signal processing units 21 so as to output digital signals obtained through AD conversion by the ADC circuits 805. The circuit driving unit 27 a and the circuit driving unit 27 b are disposed in the horizontal direction so as to sandwich the circuit array from the left and right. Similarly to the circuit driving unit 27 a and the circuit driving unit 27 b, a serializer 28 a and a serializer 28 b are disposed on the left and right of the circuit array. The image sensor 106 according to this embodiment realizes high-speed readout of signals by operating a plurality of ADC circuits 805 in parallel. Thus, signals are output from the individual ADC circuits 805 in parallel during the same period. The serializer 28 a and the serializer 28 b each include a multiplexer circuit and have a function of sequentially converting these parallel signals into serial signals so that a transfer unit 29 a and a transfer unit 29 b in the subsequent stages can transfer the signals. The transfer unit 29 a and the transfer unit 29 b each have signal line pairs of at least 24 lanes, 1 lane corresponding to a signal line pair for transferring a differential signal pair. A transmission scheme may be, for example, an LVDS scheme, an SLVS scheme, an SPI scheme, or the like, but is not limited thereto. For example, a wireless communication scheme may be adopted. In the embodiment, the pixel driving unit 13 is provided in the first substrate 10 so as not to be overlapped with the circuit driving unit 27 a and the serializer 28 a, but may be provided in the second substrate 20 depending on a disposition. For example, the pixel driving unit 13 can be disposed in the second substrate 20 by disposing the circuit driving unit 27 a, the serializer 28 a, and so forth on only one of the left and right sides of the circuit array. Alternatively, the circuit driving unit 27 a and the circuit driving unit 27 b may be disposed in the vertical direction so as to sandwich the circuit array from the upper and lower sides. With this disposition, efficient wiring can be achieved in the case of scanning the circuit array in the horizontal direction.

With reference to FIG. 29, a description will be given of the manner of connection between the pixel portions 11 and the signal processing units 21 provided in the first substrate 10 in the image sensor 106 according to this embodiment. In FIG. 29, the numerals attached to each pixel portion 11 represent the position indicated by the coordinates (column X, row Y), and the numeral attached to each signal processing unit 21 represents the number of the column X of the connected pixel portions 11.

Also in this embodiment, similarly to FIG. 8, analog signals output from the pixel portions 11 are input to the corresponding signal processing units 21 through the signal lines 803 a and 803 b. As illustrated in FIG. 29, the pixel portions 11 and the signal processing units 21 are, the signal lines 803 are disposed in the vertical direction of the image sensor 106, and correspond to the columns in the pixel array. The pixel portions 11 are connected to a corresponding one of the signal processing units 21 through the signal line 803 shared in one column. That is, each signal processing unit 21 processes the signals of the pixel portions 11 disposed in the same column. The signal lines 803 in FIG. 29 are each formed of 12 signal lines bundled together. Thus, the signals from the pixel portions 11 in 12 rows can be input to one signal processing unit 21 during the same period. That is, in this embodiment, the pixel portions 11 in 12 rows×1 column correspond to one pixel block 12. Alternatively, each signal line 803 may be formed of 13 or more signal lines. An increase in the number of signal lines makes it possible to increase the number of pixels that can be simultaneously processed. The number of wiring lines included in each signal line 803 is preferably a multiple of 4 from the viewpoint of the symmetry of the circuit or pixel portions 11. Thus, the pixel portions 11 included in each pixel block 12 are preferably arranged in 16 rows or 24 rows. The same applies to the column direction. In the case of extending the pixel block 12 in the column direction, the number of columns is preferably 2 or 4. In addition, 40 or more signal processing units 21 in the vertical direction and 200 or more signal processing units 21 in the horizontal direction are disposed on the second substrate 20 so as to form a circuit array. Preferably, the number of signal processing units 21 disposed in the vertical direction is a multiple of 4, and the number in the horizontal direction is determined in accordance with the number of horizontal pixels. Although not illustrated to simplify the figure, the individual pixel portions 11 have color filter arrangement similar to that in FIG. 3, and the pixel portion 11 disposed at the position of coordinates (0, 0) has an R color filter. In addition, although each signal line 803 is illustrated as the signal line 803 a and the signal line 803 b in FIG. 29 to simplify the description, only one of the signal lines can connect the pixel portion 11 and the signal processing unit 21 because the first substrate 10 and the second substrate 20 are stacked one on top of another.

FIG. 30 is a diagram illustrating the configuration of circuit blocks in the subsequent stage of the signal processing units 21 in the second substrate 20. To simplify the description, the circuit driving unit 27 b, the serializer 28 b, and the transfer unit 29 b are not illustrated. An operation performed using these components will be described in detail below. Digital signals obtained through AD conversion by the individual signal processing units 21 are temporarily held in predetermined buffers in the respective signal processing units 21. After that, the digital signals are sequentially read out to the serializer 28 a through output signal lines 807. The output signal lines 807 are disposed in the horizontal direction of the image sensor 106 and correspond to the rows in the circuit array. In the circuit array, the signal processing units 21 in the same row share the output signal line 807. Readout from each signal processing unit 21 is controlled by an output control signal from the circuit driving unit 27 a, and an output signal from the signal processing unit 21 subjected to output control is output to the output signal line 807. Use of the shared output signal line 807 in time division enables the number of necessary wiring lines to be reduced. In this embodiment, each output signal line 807 includes 24 wiring lines to transfer a 24-bit digital signal in parallel at high speed. An increase in the speed of signal transfer in the output signal line 807 has an influence on an increase in the speed of the entire image sensor 106, and thus the image sensor 106 is driven at high driving frequencies of 100 to 300 MHz. The driving frequencies are not limited thereto. The speed may be further increased or may be variable according to a necessary frame rate.

The digital signals read out in parallel through the output signal lines 807 are input to the serializer 28 a and converted into serial signals. The serializer 28 a includes a multiplexer circuit and sequentially converts the individual signals input during the same period into serial signals.

The transfer unit 29 a includes a differential amplifier circuit for outputting a differential signal pair, obtains serial signals converted by the serializer 28 a, and outputs the serial signals to the outside from the differential amplifier circuit by using a predetermined transmission scheme. The transfer unit 29 a has signal line pairs of at 24 lanes, 1 lane corresponding to a signal line pair for transferring a differential signal pair. In this embodiment, the signal line pairs included in the image sensor 106 correspond to 48 lanes including those of the transfer unit 29 a and the transfer unit 29 b. This corresponds to the number of signal processing units 21 disposed in the vertical direction in the circuit array, in other words, the number of output signal lines 807 connected to the serializer 28 a and the serializer 28 b. To efficiently transfer the signals output from the signal processing units 21 by the transfer unit 29 a and the transfer unit 29 b, the number of lanes of signal line pairs is desirably the same as the number of signal processing units 21 disposed in the vertical direction or the number having a common divisor or multiple. With this configuration, the period for transmitting unnecessary data or a waiting time can be reduced. In this embodiment, the differential amplifier circuit included in the transfer unit corresponds to an output unit for transferring a digital signal to the outside.

In this embodiment, all the signal lines 807 disposed in the individual rows in the circuit array are connected to the serializer 28 a, and only the signal lines 807 disposed in the even rows (X=1, 3, 5, . . . ) in the circuit array are connected to the serializer 28 b. This configuration enables a selection of an output mode of using all the 48 lanes in which signals in the odd rows are output from the transfer unit 29 a and signals in the even rows are output form the transfer unit 29 b, and an output mode of using only 24 lanes in which signals in all the rows are output from the transfer unit 29 a. Preferably, the output mode is set in accordance with the processing capacity of the DFE 108 or the DSP 109 that receives signals from the image sensor 106, or in accordance with the power allowable as an image capturing operation. Although the signal lines 807 disposed in the odd rows are connected to only the serializer 28 a to reduce the circuit scale, the signal lines 807 may also be connected to the serializer 28 b. With this configuration, the number of types of settable output modes can be increased. For example, it is possible to switch the connection to the transfer units 29 a and 29 b in units of a plurality of rows (4 rows or 8 rows) in the circuit array. In the case of performing operation in a plurality of drive modes, the number of lanes to be used can be switched for each drive mode.

A signal readout operation in this embodiment will be described in detail with reference to FIGS. 31 to 33B. FIG. 31 is a diagram illustrating the timings of output signals from the signal processing unit 21 corresponding to the column number X=0, and illustrates the timings of output signals corresponding to the pixel block 12 illustrated in FIG. 29 as a representative example. The upper part illustrates the timings of readout of signals from the 12 pixel portions 11 corresponding to one pixel block 12. For each of the pixels, a transfer period for controlling a signal PTXA and a signal PTXB, a readout period for reading out an analog signal from the pixel portion 11 to the signal line 803, and an AD conversion period in the ADC circuit 805 are illustrated. As described in detail in the foregoing embodiments, the analog signals output from the pixel portions 11 included in the pixel block 12 are input to the MPX circuit 804 of the signal processing unit 21 during the same period, and are sequentially AD-converted by the ADC circuit 805. In this embodiment, to increase transfer efficiency, each period is set so as to sequentially perform transfer and readout in accordance with the AD conversion operation by the ADC circuit 805. Specifically, the individual periods are set such that an A+B signal AD conversion period is overlapped by the next N signal readout period, and an N signal AD conversion period is overlapped by the next A+B signal readout period in terms of time. As a result of overlapping the periods in this manner, signals can be efficiently read out from the individual pixel portions 11. The digital signals generated through AD conversion by the signal processing unit 21 are temporarily held in a buffer or the like, and then output to the subsequent stage on the basis of an output control signal from the circuit driving unit 27 a or the circuit driving unit 27 b.

The lower part illustrates the output timings of the digital signals output from the signal processing unit 21. In this embodiment, the signal processing unit 21 outputs one output signal to the output signal line 807 in response to detection of a falling edge at which an output control signal is changed to a low level. In FIG. 31, a digital signal based on an output from one pixel portion 11 is represented by one frame. The numerals in the frame correspond to the coordinates of the pixel portion 11 in the pixel array. The digital signal according to this embodiment has 14 bits, but the output signal line 807 is capable of transferring a 24-bit signal in view of the case of performing computation processing, such as addition of digital signals. The signal length that can be transferred by the output signal line 807 is not 24 bits, but is selected in accordance with the transfer speed of a signal from each signal processing unit 21. That is, a signal of about 17 bits may be transferable depending on the setting of the driving frequency in the output signal line 807.

An output control signal is supplied from the circuit driving unit 27 a or the circuit driving unit 27 b to the signal processing unit 21 in accordance with an AD conversion operation in the signal processing unit 21. In this embodiment, a period from when AD conversion in a predetermined pixel block 12 ends to when AD conversion in the next pixel block 12 starts is regarded as one cycle, and control is performed to output signals corresponding to one pixel block 12 held in a buffer during the one cycle.

FIG. 32 illustrates the timings of output signals supplied to the serializer 28 a through the output signal lines 807. Each of the frames illustrated above the output signal lines 807 represents one digital signal as in FIG. 31, and the numerals in the frame correspond to the coordinates of the pixel portion 11 in the pixel array. The signals from the pixel portions 11 disposed in the odd columns of the pixel array are input to the serializer 28 a, and the signals from the pixel portions 11 disposed in the even columns are input to the serializer 28 b. In FIG. 32, the serializer 28 b and the signals in the even columns are not illustrated to simplify the description.

As illustrated in FIG. 31, an output signal is output in response to detection of a falling edge at which an output control signal is changed to a low level. On the other hand, as illustrated in FIG. 30, the signal processing units 21 in the same row share the output signal line 807 in the circuit array. Thus, the signal processing units 21 sharing the signal output line 807 are not capable of simultaneously outputting output signals. Thus, output control signals are sequentially supplied to the signal processing units 21 sharing the output signal line 807, and output is performed in time division, as illustrated in FIG. 32. More specifically, signals in the first row are sequentially output first, as illustrated in FIG. 32. At this time, output control signals are supplied to the signal processing units 21 included in the same column in the circuit array at the same timing. As an example, an output control signal is supplied to the leftmost column and then output control signals are sequentially supplied to the individual columns, and output signals corresponding to the first row in the pixel array are output. Subsequently, after output control signals have been supplied to all the signal processing units 21 in the circuit array, an output control signal is supplied again to the leftmost column. Accordingly, output signals corresponding to the second row in the pixel block are output. As a result of repeating this operation 12 times, output signals for 12 rows corresponding to one pixel block 12 are output. Furthermore, as a result of performing this operation on the other pixel blocks 12, image signals for one frame can be obtained. By changing the first or last column to which output control signals are to be supplied, a signal readout range can be controlled.

As illustrated in FIG. 31, the interval at which an output control signal is supplied to one signal processing unit 21 corresponds to the period over which AD conversion is performed. In addition, because 200 or more signal processing units 21 are disposed in the row direction in the circuit array, it is necessary to output 200 or more output signals to the output signal lines 807 to read out the signals within an interval of supplying an output control signal to one signal processing unit 21. Thus, the operating frequency in the output signal lines 807 is 100 to 300 MHz, which is high compared to the speed at which a signal is transferred from the pixel portion 11 to the signal processing unit 21.

In this embodiment, the color filters of the individual pixel portions 11 of the image sensor 106 are arranged in a Bayer array, and thus signals corresponding to the color filters of the same color are input to the serializer 29 a and the serializer 29 b at the same timing.

FIG. 33A illustrates an order in which signals are output from the transfer unit 29 a, and FIG. 33B illustrates an order in which signals are output from the transfer unit 29 b. A digital signal based on an output from one pixel portion 11 is represented by one hexagonal frame, and the signals are output in order from the signal at the top of each arrow. The numerals in each frame correspond to the coordinates of the pixel portion 11 in the pixel array. Other than digital signals based on outputs from the pixel portions 11, synchronization signals, header signals, footer signals, error correction signals, and the like are also output at predetermined timings.

The transfer unit 29 a and the transfer unit 29 b each have signal line pairs of 24 lanes and transfer one digital signal by using 6 lanes as one unit (one link). For example, a digital signal of 18 bits is transferred by assigning 3 bits to each lane. One link is not necessarily formed of 6 lanes as in this embodiment, but may be formed of 5 lanes or 7 lanes. However, the number of lanes included in one link needs to be a divisor of the number of all lanes. Alternatively, one digital signal may be transferred by one lane. In a case where the number of bits of an output digital signal is indivisible by the number of lanes in one link, a lane that does not transfer data may be provided, or the lane may transmit a part of the next digital signal. Accordingly, power consumption can be reduced and transfer efficiency can be increased.

In this embodiment, the signal lines 803 for transferring analog signals from the pixel portions 11 to the signal processing units 21 are disposed in the vertical direction, and the output signal lines 807 for transferring digital signals from the signal processing units 21 to the serializer 28 a and the serializer 28 b are disposed in the horizontal direction. In other words, in the image sensor 106 according to this embodiment, the transfer unit 29 a and the transfer unit 29 b that output signals to the outside are disposed in the horizontal direction (right-and-left direction) of the image sensor 106. Furthermore, the pixel driving unit 13 for driving the pixel portions 11, and the circuit driving unit 27 a and the circuit driving unit 27 b, are disposed in the right-and-left direction with respect to the pixel array and the circuit array, respectively. In other words, driving control lines for driving the pixel portions 11 and the signal processing units 21 are disposed in the horizontal direction.

In a conventional CMOS sensor or the like including AD conversion circuits each provided for a column of a pixel array, analog signals read out from pixels are transferred such that the signals from the same column are transferred by the same vertical signal line, and the analog signals are converted into digital signals by the AD conversion circuits disposed in the vertical direction (up-and-down direction). Subsequently, the digital signals are output from transfer units provided in the up-and-down direction. Such a configuration is preferable in the case of performing sequential readout and output in units of rows. This is because the AD conversion circuits provided for respective columns correspond to the arrangement of the pixels, and thus only sequential output of signals from the AD conversion circuits in the horizontal direction (for each column) makes it possible to obtain corresponding digital signals in the same arrangement as that of the pixel portions 11. That is, it is not necessary to rearrange the signals by a processor in the subsequent stage that has received the signals, and the necessity of a rearrangement time and a memory or the like is eliminated.

On the other hand, the image sensor 106 having a multilayer structure according to this embodiment processes signals from the pixel array disposed in the first substrate 10 by using the circuit array disposed in the second substrate 20. In this case, the positions of the pixel portions 11 in the pixel array do not necessarily match the positions of the signal processing units 21 in the circuit array. Specifically, as illustrated in FIG. 29, the signal processing units 21 corresponding to the pixel portions 11 in 40 columns disposed in the horizontal direction in the pixel array are disposed in the up-and-down direction in the circuit array. As a result of such a disposition, if the transfer units are provided in the up-and-down direction as in a conventional CMOS sensor, it is difficult to obtain corresponding digital signals in the same arrangement as that of the pixels. That is, signals are output in units of 40 columns at normal timing, which may require rearrangement or the like of the signals by a processor in the subsequent stage that receives the signals, or may require higher-speed operation, resulting in increased power consumption or decreased transfer efficiency. Thus, an effect of the present invention of performing parallel AD conversion and realizing higher speed is reduced.

Thus, in the configuration enabling simultaneous AD conversion on a plurality of analog signals according to this embodiment, it is effective to dispose the output signal lines 807 for outputting digital signals in a direction different from (for example, orthogonal to) the direction in which the signal lines 803 for reading out analog signals are disposed. In this embodiment, the vertical direction in which the signal lines 803 (first signal lines) are disposed corresponds to a first direction, and the direction in which the output signal lines 807 (second signal lines) are disposed corresponds to a second direction.

Modification Example 1

Although FIG. 30 illustrates an example in which the signal processing units 21 in the same row in the circuit array share the same output signal line 807, a plurality of output signal lines may be shared in each row. FIG. 34 is a diagram illustrating the configuration of circuit blocks in the stage subsequent to the signal processing units 21 in the second substrate 20. To simplify the description, the circuit driving unit 27 b, the serializer 28 b, and the transfer unit 29 b are not illustrated. Output signal lines 809 a and output signal lines 809 b are disposed in the horizontal direction of the image sensor 106 and correspond to the respective rows of the circuit array. The signal processing units 21 in the same row in the circuit array share the output signal line 809 a and the output signal line 809 b. More specifically, the signal processing units 21 disposed in the odd columns in the circuit array are connected to the output signal lines 809 a, and the signal processing units 21 disposed in the even columns are connected to the output signal lines 809 b. The shared output signal lines are used in time division, and thus an increase in the number of output signal lines makes it possible to increase the amount of data that can be output within a unit time. Thus, the driving frequency of transferring a signal in each output signal line can be decreased. An effect of this modification example is not limited to a decrease in driving frequency. An increased frame rate can be expected by maintaining a high driving frequency.

Although the signal processing units 21 in each row in the circuit array are connected to any one of a plurality of output signal lines, the signal processing units 21 may be configured to be connectable to a plurality of output signal lines by using a switch or the like. Which output signal line is to be selected as a connection destination is controlled by the circuit driving unit 27 a or the circuit driving unit 27 b. In this modification example, each row in the circuit array has a plurality of output signal lines. A similar effect can be obtained by assigning a plurality of wiring lines included in an output signal line. As an example, 24 bits that can be transferred by each output signal line may be divided into 12 bits and 12 bits, the signal processing units 21 disposed in the odd columns in the circuit array may be connected to the wiring line of the upper 12 bits, and the signal processing units 21 disposed in the even columns may be connected to the wiring line of the lower 12 bits. In this case, if the frame rate decreases, the driving frequency for transfer may be increased to maintain the entire frame rate.

FIG. 35 illustrates the timings of output signals supplied to the serializer 28 a through the output signal lines 809 a and the output signal lines 809 b. The signals from the pixel portions 11 disposed in the odd columns of the pixel array are input to the serializer 28 a, and the signals from the pixel portions 11 disposed in the even columns of the pixel array are input to the serializer 28 b. In FIG. 35, the serializer 28 b is not illustrated to simplify the description.

As illustrated in FIG. 35, output control signals are sequentially supplied to the signal processing units 21 that share the output signal line 809 a and the output signal line 809 b, and output is performed. More specifically, as illustrated in FIG. 35, signals in the first row are sequentially output first. At this time, output control signals are supplied at the same timing to the signal processing units 21 included in two adjacent columns in the circuit array. As an example, an output control signal is supplied to the leftmost column and then output control signals are sequentially supplied to the individual columns, and output signals corresponding to the first row in the pixel array are output. Subsequently, after output control signals are supplied to all the signal processing units 21 in the circuit array, an output control signal is supplied to the leftmost column again. Accordingly, output signals corresponding to the second row in the pixel block are output. This operation enables a plurality of signals to be transferred in each row, and signal readout can be completed in half the time. To realize timings similar to the timings of output of signals from the transfer unit 29 a and the transfer unit 29 b illustrated in FIG. 33A and FIG. 33B, it is preferable to provide a line memory that is not illustrated.

Modification Example 2

FIG. 30 illustrates an example in which the signal processing units 21 in the same row of the circuit array share the same output signal line 807. FIG. 30 further illustrates a configuration in which the signal lines 807 disposed corresponding to the odd rows and the even rows in the circuit array are alternately connected to the serializer 28 a and the serializer 28 b. However, the disposition of the signal processing units 21 and the connection of the signal processing units 21 to the individual serializers are not limited to this configuration. This modification example illustrates another example of the disposition of the signal processing units 21 and the connection of the signal processing units 21 to the individual serializers.

FIG. 36 is a diagram illustrating the configuration of circuit blocks in the stage subsequent to the signal processing units 21 in the second substrate 20 in this modification example. To simplify the description, the individual circuit driving units and the individual transfer units are not illustrated. Digital signals obtained through AD conversion by the individual signal processing units 21 are temporarily held in predetermined buffers in the signal processing units 21, and then read out thorough the corresponding output signal lines 807. In this modification example, the signal processing units 21 are disposed in units of 40 columns in the column direction in the circuit array as illustrated in FIG. 36, but are not disposed in the order of the column number X in the row direction. Specifically, the signal processing units 21 are disposed in units of 8 columns (X=8). Accordingly, 8 signal processing blocks are formed, each including 5 signal processing units 21 in the row direction. As illustrated in FIG. 36, each signal processing block corresponds to a link including 6 lanes forming one unit in the transfer unit 29 a or the transfer unit 29 b. One link shares an output circuit in each transfer unit, for example, shares one error correction circuit in each link. The error correction circuit performs an operation of giving an error correction code (ECC) to an output signal. The DFE 108 or the DSP 109 that receives signals from the image sensor 106 is capable of determining whether output signals have been normally received, by obtaining an ECC given by the error correction circuit.

Although the number of signal processing units 21 included in one signal processing block is 5 in this modification example, the number is not limited thereto. The number of signal processing units 21 included in one signal processing block corresponds to the number of usable lanes. In a case where the number of lanes is 24, it is preferable that the number of signal processing units 21 included in one signal processing block be 10. In this way, when the number of signal processing units 21 included in one signal processing block corresponds to the number of usable lanes, corresponding digital signals can be obtained in the same arrangement as the arrangement of the pixel portions 11. That is, it is not necessary to rearrange the signals by a processor in the stage subsequent to the stage that has received the signals, and the necessity of a rearrangement time and a memory or the like is eliminated. In the case of switching the number of lanes between 48 and 24, it is necessary to add a multiplexer in the serializer 28 a.

As described above, the signal lines 807 disposed corresponding to the odd rows and even rows in the circuit array need not necessarily be alternately connected to the serializer 28 a and the serializer 28 b as illustrated in this modification example. For example, in view of the configuration of a common circuit in each transfer unit in the subsequent stage, a plurality of rows may be regarded as a signal processing block, and connection to each serializer may be performed in units of signal processing blocks.

In this embodiment, an example has been given in which a pixel array includes 8000 effective pixels in the horizontal direction and 6000 effective pixels in the vertical direction. However, it is not necessary to obtain signals from all the pixel portions 11 depending on an aspect of an image signal to be obtained. For example, in an aspect ratio of 16:9 used for capturing a moving image, about 4000 pixels in the vertical direction are sufficient, and it is not necessary to read out signals from the pixel portions 11 corresponding to the residual 1000 pixels. In this case, it is preferable to perform a power saving operation for the pixel portions 11 (or pixel blocks 12) from which signals need not be read out and the corresponding signal processing units 21. The same applies to an aspect ratio of 3:2 used for a still image.

Tenth Embodiment

The image sensor 106 and the image capturing apparatus 100 described in each embodiment are applicable to various applications. For example, the image sensor 106 can be used for sensing light other than visible light, such as infrared light, ultraviolet light, or X rays. The image capturing apparatus 100 is represented by a digital camera, and is also applicable to a mobile phone equipped with a camera such as a smartphone, a monitoring camera, a game machine, or the like. Furthermore, the image capturing apparatus 100 is applicable to an endoscope or medical equipment for capturing an image of blood vessels, beauty equipment for observing skin or scalp, or a video camera for capturing a moving image of sports or actions. Also, the image capturing apparatus 100 is applicable to a traffic-purpose camera such as a camera for monitoring traffic or a drive recorder, an academic-purpose camera for observing celestial objects or specimens, a home appliance equipped with a camera, a machine vision system, or the like. In particular, application to a machine vision system is not limited to a robot in a factory or the like, and application to agriculture or fisheries is possible.

The configuration of the image capturing apparatus according to the above embodiments is merely an example, and the configuration of the image capturing apparatus to which the present invention is applicable is not limited to the configuration illustrated in FIG. 1. In addition, the circuit configurations of individual units of the image capturing apparatus are not limited to those illustrated in the figures.

The present invention can be implemented by supplying a program for executing one or more functions of the above-described embodiments to a system or apparatus via a network or storage medium and by reading and executing the program by one or more processors in a computer of the system or apparatus. Alternatively, the present invention can be implemented by a circuit executing one of more functions (for example, ASIC).

According to the present invention, it is possible to provide an image sensor and an image capturing apparatus that are capable of realizing power saving of the image sensor while suppressing a decrease in frame rate caused by an increase in the amount of data.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions. 

The invention claimed is:
 1. An image sensor comprising: a first substrate and a second substrate that are stacked one on top of another, the first substrate having a pixel array in which a plurality of pixels for performing photoelectric conversion are disposed in matrix, the second substrate having a circuit array in which a plurality of signal processing units that process first signals based on the photoelectric conversion are disposed in matrix and having transfer units that transfer second signals processed by the signal processing units to an outside, wherein the pixel array includes a plurality of pixel blocks each formed of a plurality of pixels, each of the signal processing units and a corresponding one of the pixel blocks are connected by a plurality of first signal lines, each of the signal processing units and a corresponding one of the transfer units are connected by a plurality of second signal lines, each of the signal processing units includes a conversion circuit that sequentially performs analog-to-digital conversion on the first signals input from the plurality of first signal lines during an identical period, and the transfer units are disposed in a direction different from a first direction in which the first signal lines are provided, with respect to the circuit array in the second substrate.
 2. The image sensor according to claim 1, wherein each of the pixels includes a plurality of photoelectric conversion units.
 3. The image sensor according to claim 2, wherein each of the signal processing units further includes a selecting unit that selects a signal line to be connected to the conversion circuit from among the plurality of first signal lines.
 4. The image sensor according to claim 2, wherein each of the pixel blocks includes only pixels included in an identical column, the first signal lines are provided in a column direction and the second signal lines are provided in a second direction orthogonal to the first direction, and the transfer units are provided in the second direction with respect to the circuit array in the second substrate.
 5. The image sensor according to claim 2, wherein the second signal lines are each configured to be capable of transferring a plurality of signals in each of rows in the circuit array.
 6. The image sensor according to claim 2, wherein each of the transfer units includes a plurality of output units for transferring the second signals to an outside, and each of the transfer units is capable of switching the number of the output units for transferring the second signals to the outside.
 7. The image sensor according to claim 2, wherein each of the transfer units transfers the second signals in an order corresponding to positions of corresponding pixels in the pixel array.
 8. The image sensor according to claim 1, wherein each of the signal processing units further includes a selecting unit that selects a signal line to be connected to the conversion circuit from among the plurality of first signal lines.
 9. The image sensor according to claim 8, wherein each of the pixel blocks includes only pixels included in an identical column, the first signal lines are provided in a column direction and the second signal lines are provided in a second direction orthogonal to the first direction, and the transfer units are provided in the second direction with respect to the circuit array in the second substrate.
 10. The image sensor according to claim 8, wherein the second signal lines are each configured to be capable of transferring a plurality of signals in each of rows in the circuit array.
 11. The image sensor according to claim 8, wherein each of the transfer units includes a plurality of output units for transferring the second signals to an outside, and each of the transfer units is capable of switching the number of the output units for transferring the second signals to the outside.
 12. The image sensor according to claim 8, wherein each of the transfer units transfers the second signals in an order corresponding to positions of corresponding pixels in the pixel array.
 13. The image sensor according to claim 1, wherein each of the pixel blocks includes only pixels included in an identical column, the first signal lines are provided in a column direction and the second signal lines are provided in a second direction orthogonal to the first direction, and the transfer units are provided in the second direction with respect to the circuit array in the second substrate.
 14. The image sensor according to claim 13, wherein the transfer units are provided at positions sandwiching the circuit array in the second direction in the second substrate.
 15. The image sensor according to claim 13, wherein the second signal lines are each configured to be capable of transferring a plurality of signals in each of rows in the circuit array.
 16. The image sensor according to claim 13, wherein each of the transfer units includes a plurality of output units for transferring the second signals to an outside, and each of the transfer units is capable of switching the number of the output units for transferring the second signals to the outside.
 17. The image sensor according to claim 1, wherein the second signal lines are each configured to be capable of transferring a plurality of signals in each of rows in the circuit array.
 18. The image sensor according to claim 1, wherein each of the transfer units includes a plurality of output units for transferring the second signals to an outside, and each of the transfer units is capable of switching the number of the output units for transferring the second signals to the outside.
 19. The image sensor according to claim 1, wherein each of the transfer units transfers the second signals in an order corresponding to positions of corresponding pixels in the pixel array.
 20. An image capturing apparatus comprising: the image sensor according to claim 1; obtaining means for obtaining, from the image sensor, a digital signal output from the conversion circuit; and driving control means for controlling driving of the image sensor. 